Stretchable silicon electronics and their integration with rubber, plastic, paper, vinyl, leather and fabric substrates
- PDF / 328,648 Bytes
- 7 Pages / 612 x 792 pts (letter) Page_size
- 41 Downloads / 165 Views
1196-C01-03
Stretchable silicon electronics and their integration with rubber, plastic, paper, vinyl, leather and fabric substrates Dae-Hyeong Kim1, Yun-Soung Kim1, Zhuangjian Liu2, Jizhou Song3, Hoon-Sik Kim1, Yonggang Y. Huang4 and John A. Rogers1,5 1
Departments of Materials Science and Engineering, Beckman Institute, and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, 1304 West Green Street, Urbana, Illinois 61801, USA 2 Institute of High Performance Computing, 1 Science Park Road, #01-01 The Capricorn, Singapore Science Park II, Singapore 117528 3 Department of Mechanical and Aerospace Engineering, University of Miami, Coral Gables, FL 33146, USA 4 Departments of Civil and Environmental Engineering and Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA 5 Departments of Chemistry, Mechanical Engineering, Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, 1304 West Green Street, Urbana, Illinois 61801, USA ABSTRACT Electronic systems that offer elastic mechanical responses to high strain deformations are of growing interest, due to their ability to enable new electrical, optical and biomedical devices and other applications whose requirements are impossible to satisfy with conventional waferbased technologies or even with those that offer simple bendability. This paper describes materials and mechanical design strategies for classes of electronic circuits that offer extremely high flexibility and stretchability over large area, enabling them to accommodate even demanding deformation modes, such as twisting and linear stretching to ‘rubber-band’ levels of strain over 100%. The use of printed single crystalline silicon nanomaterials for the semiconductor provides performance in flexible and stretchable complementary metal-oxidesemiconductor (CMOS) integrated circuits approaching that of conventional devices with comparable feature sizes formed on silicon wafers. Comprehensive theoretical studies of the mechanics reveal the way in which the structural designs enable these extreme mechanical properties without fracturing the intrinsically brittle active materials or even inducing significant changes in their electrical properties. The results, as demonstrated through electrical measurements of arrays of transistors, CMOS inverters, ring oscillators and differential amplifiers, suggest a valuable route to high performance stretchable electronics that can be integrated with nearly arbitrary substrates. We show examples ranging from plastic and rubber, to vinyl, leather and paper, with capability for large area coverage. INTRODUCTION Stretchable electronics on plastic sheets, metal foils, rubber slabs and other unusual substrates is an important technology for its potential role in various important future applications, such as smart fabrics, wearable biomedical monitoring systems and portable, lightweight information systems [1-8]. If clothes with smart fabrics can monitor the condition of a patient, then point of care moni
Data Loading...
