Structural, Mechanical and Erosion Properties of Yttrium Oxide Coatings by Axial Suspension Plasma Spraying for Electron
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JTTEE5 20:170–185 DOI: 10.1007/s11666-010-9585-x 1059-9630/$19.00 ASM International
Structural, Mechanical and Erosion Properties of Yttrium Oxide Coatings by Axial Suspension Plasma Spraying for Electronics Applications Junya Kitamura, Zhaolin Tang, Hiroaki Mizuno, Kazuto Sato, and Alan Burgess (Submitted May 12, 2010; in revised form September 25, 2010) Yttrium oxide (Y2O3) coatings have been prepared by axial suspension plasma spraying with fine powders. It is clarified that the coatings have high hardness, low porosity, high erosion resistance against CF4 -containing plasma and retention of smooth eroded surface. This suggests that the axial suspension plasma spraying of Y2O3 is applicable to fabricating equipment for electronic devices, such as dry etching. Surface morphologies of the slurry coatings with splats are similar to conventional plasmasprayed Y2O3 coatings, identified from microstructural analysis. Dense coating structures with no lamellar boundaries have been seen, which is apparently different from the conventional coatings. It has also been found that crystal structure of the suspension coatings mainly composed of metastable monoclinic phase, whereas the powders and the conventional plasma spray coatings have stable cubic phase. Mechanism of coating formation by plasma spraying with fine powder slurries is discussed based on the results.
Keywords
nanostructured coatings, plasma erosion, PS microstructures, suspension plasma spray, yttrium oxide
1. Introduction The size of semiconductor and flat-panel-display (FPD) production equipment used for dry etching, sputtering, and ashing have been increasing because of the increased size of Si wafer (from 200 to 300 mm in diameter) and the FPD, where plasma treatment is effectively used for micro fabrication especially in dry etching (Ref 1). Applied power for generating plasma required to fabricate the Si and LCD devices uniformly onto the large-scaled
This article is an invited paper selected from presentations at the 2010 International Thermal Spray Conference and has been expanded from the original presentation. It is simultaneously published in Thermal Spray: Global Solutions for Future Applications, Proceedings of the 2010 International Thermal Spray Conference, Singapore, May 3-5, 2010, Basil R. Marple, Arvind Agarwal, Margaret M. Hyland, Yuk-Chiu Lau, Chang-Jiu Li, Rogerio S. Lima, and Ghislain Montavon, Ed., ASM International, Materials Park, OH, 2011. Junya Kitamura, Hiroaki Mizuno, and Kazuto Sato, Thermal Spray Materials Department, Fujimi Incorporated, Kakamigahara, Gifu, Japan; and Zhaolin Tang and Alan Burgess, Northwest Mettech Corporation, 467 Mountain Highway, North Vancouver, BC, Canada. Contact e-mail: [email protected].
170—Volume 20(1-2) January 2011
substrates and to achieve high etching productivity for cost reduction has also been increasing. This trend strongly promotes application of plasma-sprayed coatings by highpurity ceramics for anti-plasma erosion at inside wall of the chamber and for high electric strengt
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