Structure of Cu-Sn Melt at High Temperature
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INTRODUCTION
A large portion of materials, particularly metals, is processed in the liquid state, e.g., casting or soldering processes. The properties and structure of a liquid material have a strong effect on the properties and structure of the final product. In recent years, considerable attention has been given to liquid–liquid structural transition (LLSS) in the fields of physics and material science. An increasing number of experiments and computer simulations has been performed on the LLSS research. Many experimental results suggest temperature-induced structural change in liquid state.[1] The LLSS induced by temperature at a constant pressure were presented on the In-Sn, In-Bi, Pb-Sn, and Pb-Bi systems above the liquidus temperature using a range of methods, such as X-ray diffraction (XRD), viscosity measurements, and electrical resistivity measurements.[2–5] Brillo et al.[6] examined the local short-to-intermediate range structure and confirmed the existence of a prepeak in liquid Al-Ni and Al-Cu alloys for liquid samples with compositions corresponding to intermetallic solid phases. Novakovic et al.[7] examined the thermodynamic, surface, and transport properties, as well as the microscopic functions (concentration fluctuations in the long-wavelength limit and chemical short-range order parameter), which indicate a weak compound-forming tendency in liquid Al-Ti alloys. Hoang[8] investigated pressure-induced structural transformation in liquid Al2O3 by molecular dynamics and reported a structural J.X. HOU, Postdoc, is with Key Laboratory for Liquid-Solid Structural Evolution & Processing of Materials, Ministry of Education, Shandong University, Jinan 250061, P.R. China, and also with the School of Advanced Materials Engineering, Kookmin University, Jeongneung-dong, Seongbuk-gu, Seoul 136-702, Korea. C.W. ZHAN, Researcher, and X.L. TIAN and X.C. CHEN, Professors, are with the Key Laboratory for Liquid-Solid Structural Evolution & Processing of Materials, Ministry of Education, Shandong University. Contact e-mails: [email protected]; [email protected] YONG-SUK KIM and HEEMAN CHOE, Professors, are with School of Advanced Materials Engineering, Kookmin University. Manuscript submitted May 30, 2011. Article published online June 23, 2012 METALLURGICAL AND MATERIALS TRANSACTIONS A
transition in liquid alumina from a tetrahedral to an octahedral network. The nonmetal–metal transition in liquid Sb-Se alloys is caused by a change in the mediumrange structure.[9] In the cesium melt, the void–void structure factor clearly indicates a structural transformation in the 1173 K to 1923 K (900 °C to 1650 °C) temperature range.[10] An obvious turning point has been observed on resistivity–temperature (q–T) curve of different Sn-Bi alloy. The discontinuous alteration with temperature revealed a liquid–liquid structural transition in the Sn-Bi melt.[11] Except extensive application in industries for their mechanical, electrical, and chemical properties, Cu-Sn alloys have a high academic interest, and the liquid Cu-Sn alloys gave ris
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