Study on Electroless Plating Ni-W-P Ternary Alloy with High Tungsten from Compound Complexant Bath
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JMEPEG (2020) 29:8213–8220 https://doi.org/10.1007/s11665-020-05312-9
Study on Electroless Plating Ni-W-P Ternary Alloy with High Tungsten from Compound Complexant Bath Wenchang Wang, Xin Ju¨, Chengyi Xu, Weiwei Zhang, Naotoshi Mitsuzaki, and Zhidong Chen Submitted: 12 July 2020 / Revised: 22 September 2020 / Accepted: 23 September 2020 / Published online: 16 November 2020 The Ni-W-P alloy coatings have been widely used in the fields of electronic, aviation and anticorrosion, owing to their high hardness, good wear resistance and strong corrosion resistance. Herein, we study the effects of complexants on the chemical composition, morphology and plating rate of the Ni-W-P ternary alloy coatings by developing a near-neutral plating solution with disodium edetate, sodium citrate and lactic acid as complex complexants. The results of scanning electron microscope (SEM) and energy-dispersive spectrometer (EDS) indicate that a flat and dense coating with the W content up to 11.75 wt.% is acquired by adjusting the composition of plating solution. Meanwhile, the plating rate of Ni-W-P coating can reach up to 22.4 lm/h. Furthermore, the characterization results indicate that the Ni-W-P ternary alloy coating possesses higher hardness, better wear and corrosion resistance compared to Ni-P coating. These findings may exploit a broader field for searching better complexants in electroless coating and for understanding the related mechanisms to provide guidance for the design of ternary alloy coatings. Keywords
complexants, electroless nickel plating, microhardness, Ni-W-P, plating rate, ternary alloy
1. Introduction The electroless Ni-P alloy coatings have been widely used in the industrial fields owing to their high hardness, corrosion and wear resistance (Ref 1). However, with the ever-increasing need of modern industry, the conventional Ni-P alloy coatings could not meet the requirements of wear and corrosion resistance in the harsh conditions of electronic devices, communication technologies and so on (Ref 2). To broaden the utilization of electroless Ni-P coatings, a lot of Ni-X-P ternary alloy coatings containing transition metals (X), such as W, Mn, Co, Cu, Mo and Re, have been widely developed. In particular, the Ni-W-P ternary alloy coatings have attracted considerable attentions because W exhibits high hardness, melting point and binding energy (Ref 3-6). The co-deposited Ni-W-P ternary alloy coatings have been widely used as contact materials, connector devices and electromagnetic shielding materials in the fields of military, electronic, anticorrosion and so on. Accordingly, parts of researchers focused on the concentration of Na2WO4 in the plating solutions to adjust the W content in the coatings (Ref 7-10). And, parts of researchers adjusted
the W and P content of Ni-W-P ternary alloy coatings by changing the conditions of electroless plating, such as temperature and pH value (Ref 11-13). Meanwhile, these plating solutions were usually alkaline or strong alkaline (Ref 6), (Ref 14-19). Balaraju et al. obtained a
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