Study on Microstructure and Shear Property of Cu/In- x Cu/Cu Transient Liquid Phase Bonding Joints
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https://doi.org/10.1007/s11664-020-08504-0 Ó 2020 The Minerals, Metals & Materials Society
Study on Microstructure and Shear Property of Cu/In-xCu/Cu Transient Liquid Phase Bonding Joints ZHENG LIU,1 LI YANG ,1,5 YU HANG XU,2 YAO CHENG ZHANG,3 KAI JIAN LU,2 FENG XU,3 and HUI MING GAO4 1.—School of Mechanical Engineering, Guilin University of Aerospace Technology, Guangxi 541004, People’s Republic of China. 2.—School of Mechanical Engineering, Soochow University, Jiangsu 215021, People’s Republic of China. 3.—School of Automatic Engineering, Changshu Institute of Technology, Jiangsu 215500, People’s Republic of China. 4.—National Dies and Molds Quality Supervision Test Center, Jiangsu 215300, People’s Republic of China. 5.—e-mail: [email protected]
Transient liquid phase (TLP) bonding is a promising interconnection technology for high-temperature electronic packaging. In this paper, the effect of Cu particles on the microstructure and shear property of Cu/In-xCu/Cu TLP joints was investigated. The results show that Cu/In-xCu/Cu joint is mainly composed of an In and Cu11In9 phase after bonded for 60 min. A small amount of Cu2In phase forms at the interface of Cu/Cu11In9 with bonding time exceeding 300 min. The bonding efficiency and shear property of In-Cu mixed particle solder joint are superior to that of the In foil solder joint, because the bonding time was reduced and the shear strength of the solder joint was improved. The phase composition of Cu11In9 and Cu2In in the joint increased, the porosity decreased and the shear strength increased with increasing Cu content. When the Cu content of the In-xCu solder was 45 wt.%, the shear strength of the Cu/In-45Cu/Cu joint reached the peak value of 15.7 MPa. Key words: In-xCu mixed particles, transient liquid phase, microstructure, shear property
INTRODUCTION The application of power electronic devices operated in harsh environments such as high temperature, strong radiation and large pressure increases with the development of many industries such as aerospace, nuclear, deep oil and gas drilling.1–4 Wide-bandgap semiconductors, especially represented by SiC and GaN that can be theoretically operated at 600°C, are candidates for high-temperature electronic devices.5,6 The trend in high-temperature applications brings great challenges to microelectronics technology, and traditional soldering methods have failed to meet the manufacturing requirements of advanced electronic systems.
(Received June 11, 2020; accepted September 21, 2020)
High-temperature solders, such as Pb-based, Pbfree and nanoparticle solder pastes have been chosen as the die-attach material for high-temperature electronic packaging. Pb-based high-temperature solders (Sn-37Pb and Pb-10Sn-2Ag), or Pbfree solders (Au-based and Bi-based solders) are limited by toxicity to the environment, low mechanical properties, high cost, or poor thermal and electrical conductivities.7–11 In addition, thermal damage and residual stress to the power devices occur as these high-temperature solders are reflowed at high
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