Surface modified and gradation-mixed Al 2 O 3 as an effective filler for the polyphenylene oxide (PPO) insulative layer
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Surface modified and gradation-mixed Al2O3 as an effective filler for the polyphenylene oxide (PPO) insulative layer in copper clad laminates Weiwei Zhang1, Chen Lu1, Mengni Ge1, Fan Bu1, and Jianfeng Zhang1,* 1
Collage of Mechanics and Materials, Hohai University, Nanjing 211100, People’s Republic of China
Received: 15 August 2020
ABSTRACT
Accepted: 13 October 2020
Although filling ceramic powders into the insulative polymer layer has long been realized as an effective strategy to elevate the heat dissipation capability and service life of copper clad laminates (CCLs), the weak interfacial bonding between inorganic filler and organic matrix and the discontinuous thermal conductive network have hindered such beneficial effects. Herein, the silane coupling agent (KH-560) modified and gradation mixed Al2O3 served as an effective filler for CCLs. After optimization of the filling scheme through tremendous efforts, the maximum thermal conductivity of corresponding CCLs with surface modified and gradation-filled Al2O3 achieved to 0.646 W/mK, apparently higher than that of pure resin CCLs (0.291 W/mK) and single-size Al2O3 filled CCLs (Al2O3-20 lm-50%, 0.573 W/mK). Simultaneously, the peel strength and bending strength of the CCLs with the surface modified and graded-mixed Al2O3 kept at a satisfactory level (0.903 N/mm and 306 MPa, respectively), surpassing those of CCLs with pristine Al2O3 fillers. In addition, the dielectric loss reduced to 4.67 9 10–3 and the water absorption was as low as 0.364%. Such a comprehensive performance could be ascribed to the improved interfacial bonding brought by KH-560 and a more contiguous heat conduction network formed by the gradation-filled Al2O3. This study offers a new strategy promising for high speed and high frequency applications of CCLs with so many alternative ceramic fillers.
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Springer Science+Business
Media, LLC, part of Springer Nature 2020
1 Introduction With the advent of 5G technology, the high speed and high frequency of signal transmission has revealed the far-from-enough heat-dissipation ability of the present copper clad laminates (CCLs) [1–3],
which is composed of a resin insulating layer covered by copper foils on both sides. Due to the lack of a uniformly dense-ordered crystal structure or charge carrier required for heat transfer, the thermal conductivity of the resin matrix is usually very low (about 0.2 W/mK) [4], where phonons are the main
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https://doi.org/10.1007/s10854-020-04673-0
J Mater Sci: Mater Electron
thermal energy carriers [5, 6]. To improve the thermal conductivity of polymers, the incorporation of ceramic fillers, such as boron nitride (BN) [7, 8], silicon dioxide (SiO2) [9, 10] and aluminum oxide (Al2O3) [11, 12], has been used widely. Especially, Al2O3 is widely used as thermal conductive filler to prepare high thermal conductive substrates due to their low price, easy availability and high thermal conductivity [7, 13, 14]. However, the introduction of
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