Thermal Contact Conductance Analysis of Nitride and Carbonitride Thin Film Coatings for Thermal Interface Material Appli
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IFICANT developments in fundamental device materials, technologies, and system integration have led to rapid increase in the total power consumption of electronic systems. When two real (rough) surfaces are placed in mechanical contact, an interface is formed and that consists of numerous discrete, micro-contact spots, and a gap that separates the two surfaces. Interstitial substances such as gases, greases, oils, and liquids completely fill the gaps and perfectly wet the interfacial surfaces, producing new interfaces which are having relatively high joint conductance. Composites, including greases doped with particulates such as silver enhance joint conductance by means of wettability of greases and hence reduced thermal resistance network is possible within the packages.[1] Currently, some phase change materials (PCMs) produce low interfacial resistances.[2] However, in thermal interface materials (TIMs) including PCMs, high conductance is achieved primarily by enhancing spread ability SHANMUGAN SUBRAMANI, Senior Lecturer, and MUTHARASU DEVARAJAN, Associate Professor, are with the Nano Optoelectronics Research Laboratory, School of Physics, Universiti Sains Malaysia, 11800 Penang, Malaysia. Contact e-mail: [email protected]; [email protected] LEE YUAN THING, Manager, is with the Test R&D Department of Intel Product (m) Sdn. Bhd, Kulim Hi Tech Park, 09000 Kedah, Malaysia. Manuscript submitted November 9, 2014. Article published online September 21, 2015 METALLURGICAL AND MATERIALS TRANSACTIONS A
and elasticity of the gap materials. Further, issues such as dry out/pump out and mechanical fatigue compromise the long-term reliability of these materials.[3] In order to avoid these issues, our research group have tried many approaches and found the high thermally conductive solid thin film prepared by sputtering especially nitride thin film as an alternative to the paste-type thermal interface material and achieved low thermal resistance when applied in between LED package and metal substrates.[4–6] But there is no information based on the influence of surface parameters on the conduct conductance as well as the thermal conductivity of the applied thin film interface materials. More recently, there has been a great deal of research carried out on developing TIMs containing carbon nano-materials such as carbon nanotubes (CNT) for improving thermal contact conductance. This has been generating a lot of interest within the microprocessor manufacturers.[7] Thin conductive layers (1–50 lm) on contacting surfaces can increase joint conductance by at least an order of magnitude. The most effective materials are those which combine high thermal conductivity with a hardness that is lower than the contacting asperities. The hardness of the deposited materials is typically more important than the thermal conductivity.[1] So it has to be addressed for the understanding of the influence of hardness as well as roughness on the thermal contact conductance of prepared nitride thin film to consider the real application. Marotta and F
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