Thermal Decomposition Kinetic Analysis and Performance Characterization of Low D k / D f Ink based on Polyurethane Acryl
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ANOSCALE AND NANOSTRUCTURED MATERIALS AND COATINGS
Thermal Decomposition Kinetic Analysis and Performance Characterization of Low Dk/Df Ink based on Polyurethane Acrylate Z. L. Xiaoa, b, Q. Liua, b, C. Zenga, b, D. X. Wua, b, *, L. B. Songa, b, Z. Caoa, b, and Y. Huangc aHunan
Provincial Key Laboratory of Materials Protection for Electric Power and Transportation, Hunan, China
bSchool of Chemistry and Food Engineering, Changsha University of Science and Technology, Changsha, Hunan, 410004 China c
Aoshikang Technology Co., Ltd., Yiyang, 413000 China *e-mail: [email protected]
Received January 2, 2020; revised May 13, 2020; accepted May 20, 2020
Abstract—Thermal analysis and Fourier transform infrared spectroscopy were used to investigate the thermal stability of two low-dielectric constant (Dk)/dielectric loss (Df) inks based on polyurethane acrylate. According to Arrhenius law, the Flynn–Wall–Ozawa method was used to calculate the apparent activation energy (as the standard apparent activation energy E0) of the ink film at weight loss rates were 10, 50 and 70% for the evaluation of its thermal aging performance. Results show that the activation energy of the ink compounded with acrylic fluorocarbon resin and polyurethane acrylate is relatively high. The Aehar–Brindey–Sharp– Wend–Worth differential method was used to analyze the most probable mechanism function of the ink film layer. The first, second, and third segments of the thermal decomposition temperature of the ink film are speculated to range from 126 to 247°C, from 247 to 384°C (follows the 3d diffusion model, and from 384 to 508°C (third-order chemical reaction), respectively. This article provides theoretical reference for the formulation design of 5G ink from the perspective of thermal decomposition mechanism and thermal stability. Keywords: 5G inks, polyurethane acrylate, activation energy, thermo-gravimetric analysis DOI: 10.1134/S2070205120050263
1. INTRODUCTION The era of 5G mobile communication, which is characterized by high-frequency, high-speed, lowpower consumption, and low-delay [1–3] signal transmission, is coming. High-performance requirements have also been suggested for printed circuit boards (PCBs), and inks that meet the requirements of 5G PCBs are an integral part of these boards. The 5G ink can ensure low dielectric loss (Df ≤ 0.008) and low dielectric constant (Dk ≤ 3.72) during the transmission of high-frequency signals [4]. The resin molecular structure polarity is an important factor that affects the Dk/Df of PCB inks. The combination of acrylic fluorocarbon resin with a small number of polar groups and low polarity chemical bonds and polyurethane acrylate to prepare a new 5G ink is preferred. 5G PCBs often carry a high power density. Thus, high requirements are imposed on the thermal aging performance of the ink. The research on its thermal decomposition performance has been described in the past by using the initial decomposition temperature of the resin, the maximum thermal decomposition temperature, the temperature cor
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