Thermally Sprayed Thin Copper Coatings by W-HVOF
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Thermally Sprayed Thin Copper Coatings by W-HVOF Satish Tailor1 • Ankur Modi1 • S. C. Modi1
Submitted: 9 April 2018 / in revised form: 4 October 2018 / Published online: 11 October 2018 Ó ASM International 2018
Abstract Thermal spray technologies are widely employed to fabricate quality thick metallic and ceramic coatings for diverse applications. Today, all sectors of the industry demand better, faster and cheaper methods of production as it seems that manufacturing demands are ever increasing. However, if the coating thicknesses below 50 microns are demanded, as a result of economic or technological requirements, it constitutes a challenge for the established thermal spraying processes. So, in the present work, an attempt has been made to deposit a thin metallic coating below 40 microns by thermal spraying through wire feedstock materials rather using an expensive powder. For a broad spectrum of copper (Cu) applications, Cu is deposited on the low-carbon steel substrates using fast, easy and economical thermal spray process wire highvelocity oxy-fuel (W-HVOF): HIJET 9610Ò. As-sprayed coatings were analyzed using x-ray diffraction, scanning electron microscopy for phase, residual stresses and microstructural analysis, respectively. Roughness of coating surface, adhesion strength and porosity were also measured. Results show that the coating deposited through W-HVOF exhibited acceptable properties and provided with a direct economic advantage and time-saving process over existing thin coating techniques.
This article is an invited paper selected from presentations at the 2018 International Thermal Spray Conference, held May 7-10, 2018, in Orlando, FL, USA, and has been expanded from the original presentation. & Satish Tailor [email protected] 1
Metallizing Equipment Company Pvt. Ltd., E-101, MIA Phase-II, Basni, Jodhpur, India
Keywords electrical conductivity microstructure porosity pull-off adhesion test residual stresses thin thermal spray coating wire-HVOF
Introduction Copper (Cu) has become the metal of choice for metallization replacing aluminum, owing to its high electrical and thermal conductivity, relatively higher melting temperature and correspondingly lower rate of diffusivity (Ref 1). These advantages have drawn significant research in the areas of pure Cu deposition. The thin Cu coating has a variety of applications such as decorative purpose, corrosion resistant, anti-microbial applications; copper is an excellent conductor, and copper plating can be used for EMI (electromagnetic interference) and RFI (radio frequency interference) shielding purposes (Ref 2-5). Copper electroplating on certain parts such as premium threaded connections, couplings, tubulars, risers, and alloy premium drill pipes which are used in oil and gas industry can be very helpful to reduce galling (Ref 6, 7). A thin coating of copper can be used to form the spinel coating on the interconnector plate (Ref 8, 9). Most of the current available thin film techniques can produce copper thin films but belo
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