Warpage Variation Analysis of Si/Solder/Cu Layered Plates Subjected to Cyclic Thermal Loading

In cyclic thermal tests of Si/solder/OFHC-Cu (silicon/solder/oxygen-free high conductivity copper)-layered plates, the authors observed either the cyclic growth or cyclic recovery of warpage to occur depending on the heat treatment of the copper before so

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Konstantin Naumenko Marcus Aßmus Editors

Advanced Methods of Continuum Mechanics for Materials and Structures

Advanced Structured Materials Volume 60

Series editors Andreas Öchsner, Southport Queensland, Australia Lucas F.M. da Silva, Porto, Portugal Holm Altenbach, Magdeburg, Germany

More information about this series at http://www.springer.com/series/8611

Konstantin Naumenko Marcus Aßmus •

Editors

Advanced Methods of Continuum Mechanics for Materials and Structures

123

Editors Konstantin Naumenko Institute of Mechanics Otto von Guericke University Magdeburg Germany

ISSN 1869-8433 Advanced Structured Materials ISBN 978-981-10-0958-7 DOI 10.1007/978-981-10-0959-4

Marcus Aßmus Institute of Mechanics Otto von Guericke University Magdeburg Germany

ISSN 1869-8441

(electronic)

ISBN 978-981-10-0959-4

(eBook)

Library of Congress Control Number: 2016936648 © Springer Science+Business Media Singapore 2016 This work is subject to copyright. All rights are reserved by the Publisher, whether the whole or part of the material is concerned, specifically the rights of translation, reprinting, reuse of illustrations, recitation, broadcasting, reproduction on microfilms or in any other physical way, and transmission or information storage and retrieval, electronic adaptation, computer software, or by similar or dissimilar methodology now known or hereafter developed. The use of general descriptive names, registered names, trademarks, service marks, etc. in this publication does not imply, even in the absence of a specific statement, that such names are exempt from the relevant protective laws and regulations and therefore free for general use. The publisher, the authors and the editors are safe to assume that the advice and information in this book are believed to be true and accurate at the date of publication. Neither the publisher nor the authors or the editors give a warranty, express or implied, with respect to the material contained herein or for any errors or omissions that may have been made. Printed on acid-free paper This Springer imprint is published by Springer Nature The registered company is Springer Science+Business Media Singapore Pte Ltd.

On the occasion of the 60th birthday of Holm Altenbach

Preface

This volume of the Advanced Structured Materials Series is dedicated to Prof. Holm Altenbach, the leading researcher and teacher in the field of applied mechanics from the Faculty of Mechanical Engineering, Institute of Mechanics, Otto-von-GuerickeUniversity Magdeburg (Germany) on the occasion of his 60th birthday. Holm has made contributions in many fields of applied mechanics, including theory of shells, mechanics of composite materials, yield and failure criteria, constitutive models for inelastic behavior, continuum damage mechanics, micro-polar continua as well as mechanics of nano-sized structures. His achievements in these areas have led to numerous national and international awards. Holm holds honorary doctorates from the National Technical University, “Kharkiv Polytechnical Institute”, Khar

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