A Brief Introduction to MEMS and NEMS
The expanding and developing fields of micro-electromechanical systems (MEMS) and nano-electromechanical (NEMS) are highly interdisciplinary and rely heavily on experimental mechanics for materials selection, process validation, design development, and de
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Wendy C. Crone
The expanding and developing fields of micro-electromechanical systems (MEMS) and nano-electromechanical (NEMS) are highly interdisciplinary and rely heavily on experimental mechanics for materials selection, process validation, design development, and device characterization. These devices range from mechanical sensors and actuators, to microanalysis and chemical sensors, to micro-optical systems and bioMEMS for microscopic surgery. Their applications span the automotive industry, communications, defense systems, national security, health care, information technology, avionics, and environmental monitoring. This chapter gives a general introduction to the fabrication processes and materials commonly used in MEMS/NEMS, as well as a discussion of the application of experimental mechanics techniques to these devices. Mechanics issues that arise in selected example devices are also presented.
9.1
Background ......................................... 203
9.2
MEMS/NEMS Fabrication ......................... 206
9.3 Common MEMS/NEMS Materials and Their Properties ............................. 206 9.3.1 Silicon-Based Materials ................ 207 9.3.2 Other Hard Materials .................... 208
9.3.3 Metals ........................................ 9.3.4 Polymeric Materials ...................... 9.3.5 Active Materials ........................... 9.3.6 Nanomaterials ............................. 9.3.7 Micromachining ........................... 9.3.8 Hard Fabrication Techniques ......... 9.3.9 Deposition .................................. 9.3.10 Lithography ................................. 9.3.11 Etching .......................................
208 208 209 209 210 211 211 211 212
9.4 Bulk Micromachining versus Surface Micromachining .............. 213 9.5 Wafer Bonding ..................................... 214 9.6 Soft Fabrication Techniques................... 215 9.6.1 Other NEMS Fabrication Strategies .. 215 9.6.2 Packaging ................................... 216 9.7
Experimental Mechanics Applied to MEMS/NEMS .......................... 217
9.8 The Influence of Scale ........................... 9.8.1 Basic Device Characterization Techniques .................................. 9.8.2 Residual Stresses in Films .............. 9.8.3 Wafer Bond Integrity .................... 9.8.4 Adhesion and Friction...................
217 218 219 220 220
9.9 Mechanics Issues in MEMS/NEMS ............. 221 9.9.1 Devices ....................................... 221 9.10 Conclusion ........................................... 224 References .................................................. 225
9.1 Background The acronym MEMS stands for micro-electromechanical system, but MEMS generally refers to microscale devices or miniature embedded systems involving one or more micromachined component that enables higher-level functionality. Similarly NEMS, nanoelectromechanical system, refers to such nanoscale devices or nanodevices. MEMS and NEMS are fab-
ricated microscale and nanoscale devices that are often made in batch
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