A Compact Planar Magnetron Plasma Sputtering Device for TiO 2 Deposition
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Erratum A Compact Planar Magnetron Plasma Sputtering Device for TiO2 Deposition – ERRATUM Michelle Marie S. Villamayor, Kenta Doi, Edna Mae D. Cruz, Freya Gay J. Avenir, Motoi Wada, and Henry J. Ramos doi: 10.1557/opl.2013.1150, Published by Materials Research Society, 29 November 2013. The article by Villamayor et al. was published with the incorrect volume number. The correct volume number is Volume 1601. The Materials Research Society and Cambridge University Press apologize to the authors for this error. The correct version of the article follows this notice.
Reference Michelle Marie S. Villamayor, Kenta Doi, Edna Mae D. Cruz, Freya Gay J. Avenir, Motoi Wada and Henry J. Ramos (2013). A Compact Planar Magnetron Plasma Sputtering Device for TiO2 Deposition. MRS Online Proceedings Library, 1601, jsapmrs13-1601-6786 doi:10.1557/opl.2013.1150.
Mater. Res. Soc. Symp. Proc. Vol. 1601 © 2013 Materials Research Society DOI: 10.1557/opl.2013 .1150
A Compact Planar Magnetron Plasma Sputtering Device for TiO2 Deposition Michelle Marie S. Villamayor1, Kenta Doi2, Edna Mae D. Cruz3, Freya Gay J. Avenir4, Motoi Wada2, Henry J. Ramos1 1 National Institute of Physics, University of the Philippines – Diliman, Quezon City, 1101 Philippines. 2 Graduate School of Science and Engineering, Doshisha University, Kyoto 610-0321, Japan. 3 Bulacan Agricultural State College, Pinaod, San Ildefonso, Bulacan, 3010 Philippines 4 Bulacan State University, Malolos City, 3000 Philippines ABSTRACT A Compact Planar Magnetron Plasma Sputtering Deposition Device (CPM-PSDD) has been used to deposit TiO2 on silicon, glass and cotton cloth. An 80 mm diameter Ti target was placed at the cathode and was sputtered by argon-oxygen plasma with 10-20 mA discharge current and -300 V to -450 V discharge potential. Reactive oxygen gas fed into the system at 13:1 Ar:O2 sccm ratio for the deposition durations between one to four hours. The deposited films exhibited both anatase and rutile phases. Cotton cloths were dipped in methyl blue to evaluate the photocatalytic activity of the film. INTRODUCTION A compact planar magnetron device (with magnets having magnetic strength of 1.1-1.2 kGauss on the surface) was developed to deposit titanium dioxide or TiO2 on Si, cloth and glass via plasma sputtering deposition. TiO2 is found to decompose H2O and degrade dyes with UV. Its oxide is known to be antibacterial and its photocatalytic property can be used for treatment of wastewater. Studies also confirmed its switchable hydrophilic property [1]. The plasma process is advantageous compared to other deposition techniques because it is a one-step-process and environmentally friendly. Alternative methods such as Sol-gel method [2], Micelle and Inverse Micelle Method [3], and Hydrothermal method [4] involve a multi-step process and create acidic and chemical wastes. The magnetron setup produces a higher yield of sputtered titanium compared to conventional PECVD [5] without heating the deposition samples. Conventional magnetron sputtering takes longer at 4.5 hours using
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