A New Temperature-Dependent Storage Modulus Model of Epoxy Resin
Temperature-dependent dynamic mechanical properties of epoxy resin were studied by dynamic mechanical analysis. A new temperature-dependent storage modulus model was developed to describe the storage modulus of epoxy resin for multi-transition regions fro
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A New Temperature-Dependent Storage Modulus Model of Epoxy Resin Jiemin Feng and Zhansheng Guo Abstract Temperature-dependent dynamic mechanical properties of epoxy resin were studied by dynamic mechanical analysis. A new temperature-dependent storage modulus model was developed to describe the storage modulus of epoxy resin for multi-transition regions from cryogenics to elevated temperatures. Model predictions showed good agreements with the experimental results. Keywords Temperature-dependent modulus • Dynamic mechanical thermal analysis • Epoxy resin • Cryogenics • Elevated temperatures
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Introduction
Polymer matrix composites (PMCs) are widely used in aerospace, automotive, and civil engineering structures due to their outstanding mechanical properties [1]. One disadvantage of these materials is that their stiffness and strength decrease significantly in the range of the glass transition temperature [2]. For designing the structures with FRP components, it is important to determine the relationship between temperature and mechanical properties in the full range of transition temperatures. Many researchers have investigated the relationship between temperature and dynamic storage modulus [3–10]. Havriliak and Negami (HN) [3] modeled the dynamic mechanical behaviors of polymers in the frequency domain. Some studies [4, 5] used the HN model to describe the temperature-dependent storage modulus by introducing an Arrhenius-type relationship between relaxation time and temperature. Bai et al. [6] modeled the temperature-dependent modulus using an Arrheniustype equation. Mahieux and Reifsnider [7, 8] suggested Weibull-type functions to describe the change in modulus over the full range of transition temperatures. Gibson et al. [9] presented a semi-empirical model that could describe the properties over the transition from the glass to rubber state. Recently, Guo et al. [10] proposed a simple temperature-dependent model that could be used to describe dynamic storage modulus and static flexural modulus. Among these models, some employing complicated expressions could predict the dynamic storage modulus in the full temperature range, while others with simple forms showed excellent agreement with experimental data for the glass transition region and rubber state. In this paper, a new model was developed to describe the progressive changes in the storage modulus of epoxy resin for multi-transition regions from cryogenics to elevated temperatures. The theoretical results were compared with corresponding experimental results.
J. Feng Department of Mechanics, Shanghai University, Shanghai 200444, China Z. Guo (*) Shanghai Institute of Applied Mathematics and Mechanics, Shanghai University, Shanghai 200072, China e-mail: [email protected] # The Society for Experimental Mechanics, Inc. 2017 B. Antoun et al. (eds.), Challenges in Mechanics of Time Dependent Materials, Volume 2, Conference Proceedings of the Society for Experimental Mechanics Series, DOI 10.1007/978-3-319-41543-7_25
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J. Feng and Z. Gu
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