A Novel Approach to Enhance the Mechanical Strength and Electrical and Thermal Conductivity of Cu-GNP Nanocomposites
- PDF / 5,886,590 Bytes
- 13 Pages / 593.972 x 792 pts Page_size
- 60 Downloads / 161 Views
INTRODUCTION
THESE days, the progress of technology and the increasing performance of electronic devices have led to devices releasing more heat and thus thermal considerations in design and materials selection in the electronic packaging industry have become seriously important factors.[1] Heat sinks, which are the cooling systems for electronic devices, have been developed to solve this issue. It was indicated that materials with a thermal conductivity higher than 150 W/(m.K) and coefficient of thermal expansion (CTE) between 4 and 9 9 106 K1 are desirable to be used in this application.[2] Among the metallic materials, copper is one of the most important candidates which can be used in the electronic packaging application, owing mainly to its high thermal and electrical conductivity and cost. However, its high thermal expansion coefficient (16.9 9 106 K1) at ambient temperature and low tensile strength limited its application. Thus, in order to address these drawbacks and broaden the application of
ABDOLLAH SABOORI, MATTEO PAVESE, CLAUDIO BADINI, and PAOLO FINO are with Department of Applied Science and Technology, Politecnico di Torino, Corso Duca Degli Abruzzi 24, 10129 Torino, Italy. Contact e-mail: abdollah.saboori@ polito.it Manuscript submitted April 6, 2017. Article published online November 21, 2017 METALLURGICAL AND MATERIALS TRANSACTIONS A
copper and its alloys, it is necessary to improve these characteristics through either fabrication of composites or heat treatment. However, in order to develop the application of copper composites, it is necessary to fabricate new composites with high thermal conductivity, high electrical conductivity, low coefficient of thermal expansion, and high mechanical properties. Hence, it is essential to design a material in order to obtain a uniform dispersion of reinforcing material as well as a strong interfacial bonding between the reinforcement and matrix. Generally speaking, copper matrix composites can be produced by the addition of stable and nonsoluble particles into the copper matrix. These nonsoluble and stable particles can be different based on the target application and they could be oxides (Al2O3, SiO2, etc.), borides (TiB2, ZrB2, etc.), nitrides (TiN, ZrN, etc.), carbides (SiC, B4C, TiC, etc.), and carbonaceous materials (CNTs, graphite, graphene, diamond).[3–7] According to the literature, due to the poor wettability between the molten copper and reinforcing particles, conventional casting techniques are not an appropriate fabrication technique for these kinds of composites. Thus, other manufacturing routes such as powder metallurgy techniques are developed to produce the copper-based composites.[8] The main areas of interest for copper and its composites are electronic packaging and heat sink industries as well as structural and frictional applications.[8–10] It should be noted that the electrical properties of copper composites can be affected seriously by the impurities such that some of VOLUME 49A, JANUARY 2018—333
them may precipitate during the heat tr
Data Loading...
