Addressing Fracture Properties of Individual Constituents Within a Cu-WTi-SiO x -Si Multilayer
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https://doi.org/10.1007/s11837-020-04444-6 2020 The Author(s)
MESOSCALE MATERIALS SCIENCE
Addressing Fracture Properties of Individual Constituents Within a Cu-WTi-SiOx-Si Multilayer MARKUS ALFREIDER and DANIEL KIENER
,1,3 JOHANNES ZECHNER,2
1
1.—Department of Materials Science, Chair of Materials Physics, Montanuniversita¨t Leoben, Leoben, Austria. 2.—KAI Kompetenzzentrum Automobil- u. Industrieelektronik GmbH, Villach, Austria. 3.—e-mail: [email protected]
With modern materials applications continually decreasing in size, e.g., microelectronics, sensors, actuators, and medical implants, quantifying materials parameters becomes increasingly challenging. Specifically, addressing individual constituents of a system, such as interfaces or buried layers in a multilayer structure, emerges as a topic of great importance. We demonstrate herein a technique to assess fracture parameters of different interfaces of a Cu-WTi-SiOx-Si model system based on in situ microcantilever testing in a scanning electron microscope. Positioning the initial notch position with respect to the interface of interest enabled selection of different crack paths, while an additional overlaid sinusoidal signal permitted continuous measurement of stiffness changes and thereby experimental measurement of the actual crack extension. We thus achieved continuous J–Da curve measurements for the interface between Cu and WTi, the bulk WTi, and the interface between WTi and SiOx. The localized nature of this novel approach makes it generally applicable to testing specific interfaces.
INTRODUCTION Due to the continuous drive towards more powerful devices, a wide variety of modern materials applications rely on very small structural features. Depending on their application based on structural, semiconducting, or optical properties, this trend leads to an increasing number of different constituents confined to a very limited volume, such as multilayers or coatings of only a few tens to hundreds of nanometers in size. Experimentally addressing the individual properties of these constituents is rather challenging, but necessary as such nano- and microscale structures can exhibit drastically different properties compared with their bulk-like counterparts, if they even exist.1 Specifically, the interface adhesion and fracture properties of such materials are a concern, as these characteristics could originate structural failure.2 Microscale fracture mechanics is a rather recent field, with
(Received August 4, 2020; accepted October 6, 2020; published online November 10, 2020)
varying approaches, such as double cantilever wedging,3 pillar splitting,4 or micro-cantilever bending as the most prominent geometries. However, most research in this field to date has been directed towards measuring single-phase fracture parameters of rather brittle materials, with only a few groups addressing interface properties. Matoy et al.5 studied the interfacial adhesion between SiOx and Cu, W, or WTi using the cantilever deflection technique, while Schaufl
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