Advanced manufacturing for transient electronics
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Introduction Microfabrication, using lithography, deposition, etching, and diffusion, can form state-of-the-art integrated circuits (ICs), typically requiring chemical and thermal resistance for the materials used. Such processes are, however, incompatible with most material candidates for transient systems, specifically as substrates, leading to the development of diverse processing approaches to avoid those issues. In the early stages, electronic components were directly fabricated on robust polymer-based substrates using chemicalfree, dry processes through shadow masks and printing techniques, although manufactured devices did not contain small, sophisticated features. Microscale conductive inks with dissolvable materials were useful for wiring and connecting lines via screen printing in a simple, fast, and cost-effective way.1–9 Exploitation of sacrificial layers allowed fabrication processes to decouple from biodegradable polymer substrates, offering the manufacture of fine and complex circuits through photolithography-based processes on separate substrates.10–13 Combined use with established, registered transfer printing could deliver electronic devices, circuits, and systems onto any type of desired substrate.14–18 Approaches to anisotropic
wet etching of a silicon wafer and to modifications of foundryproduced chips provided an opportunity to manufacture waferscale, foundry-compatible transient electronic components for practical uses.19–24 Other strategies such as facile assembly of bulk organic–inorganic components or synthesized microparticles could offer transient batteries and microrobots.25,26 In the following, we summarize the development trends of manufacturing processes for transient electronics.
Direct fabrication of electronics on transient substrates Direct fabrication of electronics on transient substrates by spin-casting and thermal or e-beam deposition methods have been exploited. These can be categorized depending on the type of material used as follows.
Fabrication methods based on organic materials Bettinger et al. proposed the first approach toward direct fabrication of organic materials-based biodegradable electronics (Figure 1a).1 They fabricated an organic thin-film transistor by spin-casting poly(vinyl alcohol) (PVA) as a dielectric onto a poly(L-lactide-co-glycolide) (PLGA) substrate, and
Won Bae Han, KU-KIST Graduate School of Converging Science and Technology, Korea University, Republic of Korea; [email protected] Gwan-Jin Ko, KU-KIST Graduate School of Converging Science and Technology, Korea University, Republic of Korea; [email protected] Jeong-Woong Shin, KU-KIST Graduate School of Converging Science and Technology, Korea University, Republic of Korea; [email protected] Suk-Won Hwang, KU-KIST Graduate School of Converging Science and Technology, Korea University, Republic of Korea; [email protected] doi:10.1557/mrs.2020.22
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