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1052-DD03-15

Aligned Low Temperature Wafer Bonding for MEMS Manufacturing: Challenges and Promises Viorel Dragoi1, Thorsten Matthias2, Gerald Mittendorfer1, and Paul Lindner1 1 Technology, EV Group, DI Erich Thallner Str. 1, St. Florian am Inn, Austria 2 Technology, EV Group Inc., 7700 South River Parkway, Tempe, AZ, 85284 ABSTRACT The increased complexity of current generations of MEMS devices imposes new requirements for wafer bonding. Among these can be mentioned low process temperature (

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