Application of Heating Type Micro-Assembly Device in Two-Photon Micromachining
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Application of Heating Type Micro-Assembly Device in Two-Photon Micromachining Jintao XIA, Afei DING, Pan WANG, Hang WANG, Yinwei GU, Weidong TAO*, and Gang WANG* School of Physical Science and Technology, Ningbo University, Ningbo 315211, China *
Corresponding authors: Weidong TAO and Gang WANG
E-mails: [email protected]; [email protected]
Abstract: The development of micro-fabrication and micro-assembly technology is indispensable for the future manufacturing of miniaturized, functional, and integrated devices. This paper proposes a planar micro-assembly technology to make the assembly of micro-objects easier. Firstly, delicate three-dimensional (3D) structures were fabricated on glass and silicon slice substrates using femtosecond laser two-photon polymerization (2PP). Secondly, transparent fluorescent scintillation ceramic powder, referred to as fluorescent powder, was assembled using a laboratory-made 3D moving heating micro-operator into a microstructure on a glass substrate, and this device is used to assemble the graphene powder into the microstructure on the silicon slice substrate. The fluorescence spectra and Raman spectra characterizations of the fluorescent powder and graphene powder in the microstructure were carried out by using excitation light at 405 nm and 532 nm, respectively. According to the above results, it can be concluded that the powder properties of the fluorescent powder and graphene powder assembled into the microstructure were not changed. The experimental device could not only assemble many micron-sized powder materials into hollow microstructures of arbitrary shape but also joined microstructures with different materials and characteristics to form a complex hybrid microstructure system. Keywords: Two-photon polymerization; micro-assembly; fluorescence; graphene Citation: Jintao XIA, Afei DING, Pan WANG, Hang WANG, Yinwei GU, Weidong TAO, et al., “Application of Heating Type Micro-Assembly Device in Two-Photon Micromachining,” Photonic Sensors, DOI: 10.1007/s13320-020-0599-9.
1. Introduction With the rapid development of the micro-nano technology, the trend of product miniaturization is increasingly apparent. More and more precise micro-devices were manufactured and applied in various advanced fields, such as aerospace [1], automobile manufacturing [2], genetic engineering [3], and life sciences [4]. At present, the importance of micro-assembly and the micromanipulation technology has become increasingly prominent.
Because micro-assembly is mainly aimed at micron-level devices, which are light in weight, low in energy consumption, and low in inertia, the assembly is difficult, during the assembly process. Therefore, for the precision type, the assembly of micro devices has gradually become the focus of attention in the industry [5]. For example, Köhler et al. [6] used a holographic optical device to capture, move, and assemble microstructures of different structures in a non-contact manner by using their optical forces to form complex hybrid
Received: 29 September 2019 /
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