Applications of Raman Spectroscopy in Cu CMP: In-situ Detection of Chemical Species in the Slurry
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0914-F12-02
Applications of Raman Spectroscopy in Cu CMP: In-situ Detection of Chemical Species in the Slurry Siddartha Kondoju1, Pierre Lucas1, Srini Raghavan1, Paul Fischer2, Mansour Moinpour3, and Andrea Oehler4 1 The University of Arizona, Tucson, AZ, 85721 2 Components Research, Intel Corp., Portland, OR, 97124 3 Components Research, Intel Corp., Santa Clara, CA, 95052 4 Fab Materials, Intel Corp., Portland, OR, 97124 Slurries used for copper CMP have a rich chemistry, which may change during the course of polishing due to consumption and decomposition of molecular species. Various aspects, such as small layer thickness (
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