Book Reviews
- PDF / 192,580 Bytes
- 1 Pages / 604.8 x 806.4 pts Page_size
- 61 Downloads / 156 Views
Thermophysical Properties of Materials
are of chief concern. If all solutions had a models that have been applied to CVD sysnearly ideal entropy of mixing, the world tems. The chapter on plasma-assisted would be a simpler place. CVD, however, emphasizes the physical G. Grimvall and electrical characteristics of the plasma In another section, Grimvall makes an (Elsevier Science Publishers, 1986) and could be improved by adding a discusdistinction between heat capacThermophysical Properties of Materials important is sion of how this couples to the chemistry of ity at constant pressure and heat capacity Volume XVni in a series of monographs on the system. These chapters also introduce reduced to a fixed pressure. Another imselected topics in solid state physics being the reader to different types of CVD reacportant distinction which I would like to published by Elsevier's North-Holland tors and some of their advantages and dishave seen included is the one between Physics division. Goran Grimvall, a welladvantages. heat capacity at saturation (usually, what is known researcher in the field, has comactually measured) and that at constant The third and fourth chapters detail bined theory, approximations, insights, pressure or volume. The same distinction processes used for thermal CVD of the and rules of thumb in an attempt to bridge tor other thermodynamic functions would most widely used materials: silicon dioxide the (often vast) gap between fundamental and nitride, polyoystalline and epitaxial solid state physics and its application to en- also apply. silicon, tungsten, aluminum, and metal siDespite these minor complaints, I can gineering materials. It is a tribute to his licides. The processes generally used to derecommend this book to workers in therworking knowledge of the field that in only posit such films are described, as are the 348 pages he has succeeded in producing a mophysics and those interested in the apways these materials are used in microelecplication of theory to practical systems. guide for the perplexed. tronic devices. In addition, considerations Because of the brevity of systematic develThe coverage is broad and quite varied in such as deposition rates and uniformities, opment it is not well suited for instrucextent. Lattice and defect energetics and film properties, step coverage, and defects tional use, but as a brief guide for dynamics are discussed extensively along are introduced. experienced workers it is admirable. with thorough descriptions of elastic prop discussions on plasma-assisted erties and heat capacity. Separate chapters Reviewer: Leonard Leibowitz is a group leader Similar in CVD processes used to deposit these mateare devoted to thermal expansion and to the Chemical Technology Division, Argonne rials are included in the fifth chapter. Deelectrical and thermal conductivity. Of parNational Labomtory. His work deals chiefly scriptions, photographs and schematics of ticular interest are the final chapters on with the physical chemistry of nuclear reactor commercial CVD reactors g
Data Loading...
