Carbon Nanotubes for Interconnects Process, Design and Applications
This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabri
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bon Nanotubes for Interconnects Process, Design and Applications
Carbon Nanotubes for Interconnects
Aida Todri-Sanial • Jean Dijon • Antonio Maffucci Editors
Carbon Nanotubes for Interconnects Process, Design and Applications
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Editors Aida Todri-Sanial CNRS-LIRMM/University of Montpellier Montpellier, France
Jean Dijon CEA LITEN Grenoble, France
Antonio Maffucci University of Cassino and Southern Lazio Cassino, Italy
ISBN 978-3-319-29744-6 ISBN 978-3-319-29746-0 (eBook) DOI 10.1007/978-3-319-29746-0 Library of Congress Control Number: 2016941054 © Springer International Publishing Switzerland 2017 This work is subject to copyright. All rights are reserved by the Publisher, whether the whole or part of the material is concerned, specifically the rights of translation, reprinting, reuse of illustrations, recitation, broadcasting, reproduction on microfilms or in any other physical way, and transmission or information storage and retrieval, electronic adaptation, computer software, or by similar or dissimilar methodology now known or hereafter developed. The use of general descriptive names, registered names, trademarks, service marks, etc. in this publication does not imply, even in the absence of a specific statement, that such names are exempt from the relevant protective laws and regulations and therefore free for general use. The publisher, the authors and the editors are safe to assume that the advice and information in this book are believed to be true and accurate at the date of publication. Neither the publisher nor the authors or the editors give a warranty, express or implied, with respect to the material contained herein or for any errors or omissions that may have been made. Printed on acid-free paper This Springer imprint is published by Springer Nature The registered company is Springer International Publishing AG Switzerland
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Preface
Our modern society has gained enormously from novel miniaturized microelectronic products with enhanced functionality at ever-decreasing cost. However, as size goes down, interconnects become major bottlenecks irrespective of the application domain. Current electrical copper (Cu) interconnects will approach their physical limits and may no longer be able to keep pace with a processor’s data throughput. Aggressive scaling has aggravated Cu resistivity increase due to electron scattering, and even more severely, it introduced electromigration issues. Mass transport along interfaces and grain boundaries in Cu interconnects is one of the most imminent issues to be addressed for future technology nodes. Interconnect innovation with novel material such as carbon nanotubes has been the focus of extensive research with the goal of propagating terabits/second at femtoJoule per bit. Carbon nanotubes have sparked a lot of interest because of their desirable properties such as large electron mean free path, mechanical strength, high thermal conductivity, and large current carrying capacity. The advent of carbon nanotube as new material for back-end of
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