Copper electrodeposition under a weak magnetic field: effect on the texturing and properties of the deposits
- PDF / 2,969,925 Bytes
- 9 Pages / 595.276 x 790.866 pts Page_size
- 12 Downloads / 286 Views
RESEARCH ARTICLE
Copper electrodeposition under a weak magnetic field: effect on the texturing and properties of the deposits S. V. Kovalyov1 · O. B. Girin1 · C. Debiemme‑Chouvy2 · V. I. Mishchenko1 Received: 22 April 2020 / Accepted: 10 October 2020 © Springer Nature B.V. 2020
Abstract The effect of a weak magnetic field (induction of 0.5 to 0.7 mT) on the electrodeposition process and the formation of crystallographic texture, morphology and properties of copper deposits has been considered. Electrodeposition studies were performed using cyclic voltammetry, chronoamperometry, and chronopotentiometry. X-ray texture analysis and scanning electron microscopy observations were used to study the texture and the morphology of the copper deposits. Some of their properties were obtained by measuring their microhardness and reflectivity. The effects of decreasing the rate of copper electrodeposition, enhancing texture formation and refinement of grain aggregates of the surface of copper films under the influence of a weak magnetic field have been evidenced. The interrelation of the texture and morphology of the copper electrodeposit surface with their microhardness and reflectivity have been revealed. The conditions for obtaining copper deposits with enhanced microhardness and reflectivity have been determined. It is shown that the electrochemical deposition with a weak magnetic field is a promising direction for obtaining materials with desired properties, without using strong magnetic fields and adding surfactants to the electrolyte. Graphic abstract
Keywords Electrodeposition · Magnetic field · Copper · Texture · Surface morphology · Microhardness · Reflectivity
Extended author information available on the last page of the article
13
Vol.:(0123456789)
1 Introduction A significant number of publications have been devoted to studying the effect of a magnetic field on the electrodeposition and structure formation of copper films [1–13]. This is due to the fact that copper deposits, electrodeposited under the influence of a magnetic field, exhibit enhanced characteristics of their properties. According to the data reported in [1], the use of a magnetic field of 1.2 T during copper electroreduction leads to a decrease in overpotential and an increase in the deposition rate of copper. According to the data obtained by Fattahi and Bahrolloom [2], by using a pulse plating process combined with a magnetic field of 0.12–0.24 T, copper deposits with a finer grain can be obtained. A number of publications [3–6] attribute the improvement in the quality of copper deposits to the influence of a strong magnetic field (induction of 0.25 to 1 T). However, as noted in Ref. [7], the influence of a magnetic field on the deposition rate of copper becomes noticeable only when using a magnetic field with induction above 4 T. In addition, some authors question the influence of a magnetic field both up to 10 T [8] and less than 0.5 T [9] on the process of copper (II) electroreduction. There is also an ambiguous opinion about t
Data Loading...
