Copper/functionalized-carbon nanotubes composite films with ultrahigh electrical conductivity prepared by pulse reverse
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Copper/functionalized‑carbon nanotubes composite films with ultrahigh electrical conductivity prepared by pulse reverse electrodeposition Dawei Li1,2 · Jiangli Xue1 · Tingting Zuo1 · Zhaoshun Gao1,2,3 · Liye Xiao1 · Li Han1 · Shaofu Li3,4 · Yafeng Yang3,4,5 Received: 3 April 2020 / Accepted: 8 July 2020 © Springer Science+Business Media, LLC, part of Springer Nature 2020
Abstract Carbon nanotubes (CNTs) have been proved a significant role as the reinforcement material in improving the mechanical and electrical properties of metal matrix composites due to their high mechanical properties, excellent electrical and thermal conductivity as well as unique atomic structure. In addition, the dispersion of CNTs has been a key factor in fabricating of metal-based complex especially for copper (Cu) with performance improvement. In the present paper, the well dispersion of functionalized CNTs (F-CNTs) is obtained at the first time, accompanied by using pulse reverse electrodeposition (PRED) technology, leading to formation of the ultrahigh electrical conductivity composite films of Cu/F-CNTs. These composite films exhibit an ultrahigh electrical conductivity of up to 6.1 × 107 S/m (increased by 105.4% of that international annealed copper standard, IACS), but maintain a high hardness of 82.3 HV and tensile strength of 297.1 MPa. It is believed that this work opens new perspectives to develop ultrahigh electrical conductivity composite materials and would role as electric wire for reducing energy loss.
1 Introduction
Electronic supplementary material The online version of this article (https://doi.org/10.1007/s10854-020-03974-8) contains supplementary material, which is available to authorized users. * Zhaoshun Gao [email protected] 1
Interdisciplinary Research Center, Institute of Electrical Engineering, Chinese Academy of Science, Beijing 100190, People’s Republic of China
2
School of Electronic, Electrical and Communication Engineering, University of Chinese Academy of Sciences, Beijing 100049, People’s Republic of China
3
Dalian National Laboratory for Clean Energy, Dalian Institute of Chemical Physics, Chinese Academy of Sciences, Dalian 116023, People’s Republic of China
4
State Key Laboratory of Multiphase Complex Systems, Institute of Process Engineering, Chinese Academy of Sciences, Beijing 100190, People’s Republic of China
5
School of Chemical Engineering, University of Chinese Academy of Sciences, Beijing 100049, People’s Republic of China
The development of new kinds of nanostructure composite materials with high performance as ultrahigh electrical conductivity is very important for using in aerospace and electronical industries [1]. Copper (Cu), as the high electrical conductivity and excellent plasticity material, has been attracted tremendous attention due to their wide applications in mechatronics, aircraft manufacturing, electrical automation and other fields. Many attempts have been made to improve the properties of Cu matrix by grain refinement [2, 3] or introducing the
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