Correction to: Effect of bonding temperature and holding time on properties of hollow structure diffusion bonded joints

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Correction to: Effect of bonding temperature and holding time on properties of hollow structure diffusion bonded joints of TC4 alloy Wenjing Gao1 · Shuming Xing1 · Junxiang Lei2

© Springer Nature Switzerland AG 2020

Correction to: SN Applied Sciences (2020) 2:1960 https​://doi.org/10.1007/s4245​2-020-03760​-5

Publisher’s Note Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.

There were some errors in Tables 1, 2 and 3, and in Figure 9b in the initial online publication. The original article has been corrected.

The original article can be found online at https​://doi.org/10.1007/s4245​2-020-03760​-5. *  Wenjing Gao, [email protected] | 1School of Mechanical, Electronic and Control Engineering, Beijing Jiaotong University, Beijing 100044, China. 2School of Materials Science and Engineering, University of Shanghai for Science and Technology, Shanghai 200093, China. SN Applied Sciences

(2020) 2:2113

| https://doi.org/10.1007/s42452-020-03898-2

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