Critical and Sub-critical Debonding in Nano-clustering Porous Low-k Films

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0914-F02-10

Critical and Sub-critical Debonding in Nano-clustering Porous Low-k Films R. S. Smith1, C. J. Uchibori2, P. S. Ho1, and T. Nakamura3 1 Materials Science and Engineering, University of Texas @ Austin, Austin, Texas, 78758 2 Fujistu America, Inc., Sunnyvale, California 3 Fujitsu LTD, Tokyo, 197-0833, Japan ABSTRACT Very few porous low-k dielectric materials meet the basic requirements for integration into the back end of the line (BEOL) metallization. Candidates for the 45 nm node need a k

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