Design and Implementation of Fully-Integrated Inductive DC-DC Converters in Standard CMOS

Technological progress in the semiconductor industry has led to a revolution towards new advanced, miniaturized, intelligent, battery-operated and wireless electronic applications. The required supply voltage(s) of these applications seldom matches the va

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ANALOG CIRCUITS AND SIGNAL PROCESSING Series Editors: Mohammed Ismail. The Ohio State University Mohamad Sawan. École Polytechnique de Montréal

For other titles published in this series, go to www.springer.com/series/7381

Mike Wens  Michiel Steyaert

Design and Implementation of Fully-Integrated Inductive DC-DC Converters in Standard CMOS

Dr. Mike Wens ESAT-MICAS Dept. Elektrotechniek K.U. Leuven Room 91.22, Kasteelpark Arenberg 10 Leuven B-3001 Belgium [email protected] Series Editors: Mohammed Ismail 205 Dreese Laboratory Department of Electrical Engineering The Ohio State University 2015 Neil Avenue Columbus, OH 43210 USA

Prof. Dr. Michiel Steyaert ESAT-MICAS Dept. Elektrotechniek K.U. Leuven Kardinaal Mercierlaan 94 Heverlee B-3001 Belgium [email protected]

Mohamad Sawan Electrical Engineering Department École Polytechnique de Montréal Montréal, QC Canada

ISBN 978-94-007-1435-9 e-ISBN 978-94-007-1436-6 DOI 10.1007/978-94-007-1436-6 Springer Dordrecht Heidelberg London New York Library of Congress Control Number: 2011928697 © Springer Science+Business Media B.V. 2011 No part of this work may be reproduced, stored in a retrieval system, or transmitted in any form or by any means, electronic, mechanical, photocopying, microfilming, recording or otherwise, without written permission from the Publisher, with the exception of any material supplied specifically for the purpose of being entered and executed on a computer system, for exclusive use by the purchaser of the work. Cover design: VTeX UAB, Lithuania Printed on acid-free paper Springer is part of Springer Science+Business Media (www.springer.com)

To my wife Larissa and our daughter Anna

Preface

Technological progress in the semiconductor industry has led to a revolution towards new advanced, miniaturized, intelligent, battery-operated and wireless electronic applications. The base of this still ongoing revolution, commonly known as Moore’s law, is the ability to manufacture ever decreasing transistor sizes onto a CMOS chip. In other words, the transistor density increases, leading to larger quantity of transistors which can be integrated onto the same single chip die area. As a consequence, more functionality can be integrated onto a single chip die, leading to Systems-on-Chip (SoC) and reducing the total system cost. Indeed, the cost of electronic applications depends in a inverse-proportional fashion on the degree of on-chip integration, which is the main drive for CMOS scaling. A SoC requires both analog and digital circuitry to be combined in order for it to be able to interact with the analog world. Nevertheless, it is usually processed in a native digital CMOS technology. These CMOS technologies are optimized for the integration of large-scale digital circuits, using very small transistors and low power supply voltages to reduce the power consumption. Beside for the purpose of decreasing the (dynamic) power consumption, the power supply voltage of deep-submicron CMOS technologies is also limited due to the physi