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Effect of Laser Thermal Processing on Defect Evolution in Silicon Erik Kuryliw, Kevin S. Jones, David Sing1, Michael J. Rendon1, and Somit Talwar2 SWAMP Center, University of Florida Dept. of Materials Science and Engineering P.O. Box 116130, Gainesville, FL 32611-6130 1 Motorola/International Sematech, Austin TX 2 Verdant Technologies, Santa Clara CA ABSTRACT Laser Thermal Processing (LTP) involves laser melting of an implantation induced preamorphized layer to form highly doped ultra shallow junctions in silicon. In theory, a large number of interstitials remain in the end of range (EOR) just below the laser-formed junction. There is also the possibility of quenching in point defects during the liquid phase epitaxial regrowth of the melt region. Since post processing anneals are inevitable, it is necessary to understand both the behavior of these interstitials and the nature of point defects in the recrystallized-melt region since they can directly affect deactivation and enhanced diffusion. In this study, an amorphizing 15 keV 1 x 1015/cm2 Si+ implant was done followed by a 1 keV 1 x 1014/cm2 B+ implant. The surface was then laser melted at energy densities between 0.74 and 0.9 J/cm2 using a 308 nm excimer-laser. It was found that laser energy densities above 0.81 J/cm2 melted past the amorphous-crystalline interface. Post-LTP furnace anneals were performed at 750 ˚C for 2 and 4 hours. Transmission electron microscopy was used to analyze the defect formation after LTP and following furnace anneals. Secondary ion mass spectrometry measured the initial and final boron profiles. It was observed that increasing the laser energy density led to increased dislocation loop formation and increased diffusion after the furnace anneal. A maximum loop density and diffusion was observed at the end of the process window, suggesting a correlation between the crystallization defects and the interstitial evolution. INTRODUCTION Ion implantation and annealing has long been the accepted method for introducing and activating dopants into silicon. During the implantation process point defects are generated, via nuclear collisions. Upon subsequent annealing to activate the dopant, these point defects, typically interstitial silicon atoms, promote enhanced dopant diffusion, agglomerate into extended defects, as well as participate in dopant clustering1,2. One technique that shows promise in circumventing conventional problems is laser thermal processing (LTP) 3. Laser thermal processing begins by forming a pre-amorphized silicon layer via isoelectronic ion implantation. This layer is further implanted with dopant that is contained within the amorphous region. An excimer laser is then used to melt the pre-amorphized layer. The melt region is confined to the amorphous layer due to the reduced melting temperature of amorphous silicon compared to crystalline silicon. The junction depth forms at the amorphous-crystalline (a-c) interface for a range of energy densities termed the process window. For energy densities below the process window,