Effects of Ni Nanoparticles on the Growth Rate of Intermetallic Compounds (IMCs) Between Sn-3.0Ag-0.5Cu (SAC305) Solder
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https://doi.org/10.1007/s11664-020-08453-8 Ó 2020 The Minerals, Metals & Materials Society
Effects of Ni Nanoparticles on the Growth Rate of Intermetallic Compounds (IMCs) Between Sn-3.0Ag-0.5Cu (SAC305) Solder and Cu-2.0Be Substrate ZUOZHU YIN
,1,2,4 MEI LIN,2 QI LI,2 and XIAOCHUN LV3
1.—Key Laboratory for Microstructural Control of Metallic Materials of Jiangxi Province, Nanchang Hangkong University, Nanchang 330063, China. 2.—School of Aerospace Manufacturing Engineering, Nanchang Hangkong University, 696 Fenghe South Road, Nanchang 330063, China. 3.—Harbin Welding Institute Limited Company, Harbin 150028, China. 4.—e-mail: [email protected]
The effect of Ni nanoparticles on the microstructure evolution of a Sn-3.0Ag0.5Cu (SAC305)-xNi (x = 0, 0.1)/Cu-2.0Be solder joint during reflow and aging was investigated. The results showed that the doped Ni nanoparticles changed the intermetallic compound (IMC) morphology from a scallop-like structure into a planar-like structure. The interfacial IMC layer thickness of the SAC305/Cu-2.0Be solder joint was greater than that of the SAC305-0.1Ni/Cu2.0Be solder joint after reflow and aging. During reflow, the average IMC growth rate of the SAC305/Cu-2.0Be solder joint was 1.62 9 102 lm/s, while the average IMC growth rate of the SAC305-0.1Ni/Cu-2.0Be solder joint was 1.56 9 102 lm/s. During aging, the growth rates of the interfacial IMC layer of the SAC305/Cu-2.0Be solder joint and SAC305-0.1Ni/Cu-2.0Be solder joint were 1.86 9 105 lm/s and 1.46 9 105 lm/s, respectively. The results show that a trace amount of Ni nanoparticles can impede the growth rate of the interfacial IMC layer. Key words: Ni nanoparticles, solder joint, microstructure evolution, reflowing, thermal aging
INTRODUCTION In modern aircraft electronic devices, soldering is a very common method for achieving the connection between substrate and chip, which can provide good reliability and mechanical connection.1,2 Therefore, it is vital to improve the reliability of the solder joint in electronic devices such as cell phones, laptops and smart devices.3–5 The Cu-2.0Be alloy is widely used as a substrate in aircraft electronic devices, and is the best candidate to replace the pure Cu substrate due to its good corrosion resistance, mechanical properties and wettability.6 In order to improve the reliability of the total device, it is vital to investigate the interfacial IMC layer of the solder joint.7,8 As is
(Received December 3, 2019; accepted August 25, 2020)
known, a certain interfacial IMC thickness of a solder joint can improve reliability.9,10 In order to obtain such ideal results, many methods have been used, including adding alloy elements (Bi, Zn, rare earth, etc.),11–14 using different substrates15–18 and adding different nanostructure materials.19–25 Among these methods, adding nanostructure material is a good choice due to its high specific surface and good conductivity.26 The (Cu, Ni)6Sn5 interfacial intermetallic compound (IMC) layer was formed at the Sn-3.8Ag-0.7Cu-xNi solder joint, which
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