Enhancement of Impedance Matching of Rectangular Patch to the Elimination of the Surface Waves
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Enhancement of Impedance Matching of Rectangular Patch to the Elimination of the Surface Waves Basheer Ali Sheik1 · P. V. Sridevi1 · P. V. Rama Raju2 Accepted: 5 November 2020 © Springer Science+Business Media, LLC, part of Springer Nature 2020
Abstract This paper presents to enhance the input impedance matching of the rectangle microstrip patch due to the dwindling of the surface waves. The properties of this antenna have been enhanced by the enhancement of the input impedance matching. This is to achieve with the use of three techniques, which are the defective ground structure, intrude a U-shaped slot on a patch, and 1-D EBG structure. This antenna has designed on both sides of the FR4 epoxy substrate of a thickness of 1.6 mm at 2.4 GHz to the simulation and fabrication. The results of this antenna have been good agreement between both the simulations and fabricate designs. This antenna can applicable to LTE (4G), WiFI, WiMax, UMTS, and 3G/2G mobile communications. Keywords MSA · U-slot · EBG · Partial ground or DGS · Fractal star shaped array and wideband
1 Introduction Nowadays, wireless communication is playing an important role in communication systems. The communication systems are such as WiFi modems, mobile communication systems, WiMAX, IoT systems, the Global Position System (GPS), etc. An antenna is an important device in wireless communication systems to transmit and/or receive the signal from the air. An antenna requires small in size, use of less power consumption, high-speed response, cost-effective for manufacture, easy to design in MMIC, and user-friendly operation. Most of these requirements are fulfilled by Microstrip antenna (MSA).
* Basheer Ali Sheik [email protected] P. V. Sridevi [email protected] P. V. Rama Raju [email protected] 1
Department of Electronics and Communication Engineering, Andhra University College of Engineering, Visakhapatnam, Andhra Pradesh, India
2
SRKR Engineering College, Bhimavaram, Andhra Pradesh, India
13
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B. A. Sheik et al.
A few points regard a Microstrip Patch Antenna (MSA) are going to discussed here. The MSA has three layers, which are a radiator or patch (top layer), a substrate (Middle layer), and a ground plane (bottom layer). The patch and the ground planes are conductive materials such as copper, gold, etc., the substrates are the dielectric materials such as RTDuroid, FR4 epoxy, Teflon, glass, air, etc. The different feeding techniques are being fed MSA for excitation of the radiator such as edge fed, the inset fed, probe fed, proximity fed and aperture couple fed. The pros of An MSA are low weight, low cost, easy to fabrication in MMIC boards, but its performance has been demised by narrowband, low gain, low directivity, and cannot handle high power. This paper is concentrated on the overcome of some of the drawbacks of an MSA with enhance of input impedance matching due to reducing the storage energy in between the radiator and the ground planes [1–5]. This energy has been developed by high inductive load due to
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