Enhancing thermal conductivity of the insulating layer of high-frequency copper clad laminates via incorporating surface
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Enhancing thermal conductivity of the insulating layer of highfrequency copper clad laminates via incorporating surface modified spherical hBN fillers Mengni Ge1 · Qingqing Li1 · Jianfeng Zhang1 · Chunlong Zhao1 · Chen Lu1 · Zheng Yin2 · Changhong Yu2 Received: 20 November 2019 / Accepted: 21 January 2020 / Published online: 3 February 2020 © Springer Science+Business Media, LLC, part of Springer Nature 2020
Abstract The rapid development of modern information technology needs highly thermal-conductive with high-frequency copper clad laminates (HFCCLs) as a key point. In this study, ShBN (spherical hexagonal boron nitride) and ShBN/KH550 (surface modified by KH550) were used as fillers to enhance the thermal conductivity for the insulating layer of HFCCLs. Due to the merits of not only the rotational symmetry for effective thermal networks, but also a compatibility with the polymer matrix, the ShBN/KH550 filled with HFCCLs (SK-CCLs) could reach a high value of 1.18 W m −1K−1 when the content of the filler was 63 wt%. On the other hand, the incorporation of ShBN and ShBN/KH550 fillers had led to the decrease the dielectric losses with a low dielectric permittivity even at a high testing frequency of 5 GHz. In addition, the peel strength and flexural strength of the HFCCLs were not significantly reduced with the addition of either ShBN or ShBN-KH550 fillers, showing the same downward trend. This study presents a new direction to promote the conductive insulating layer for HFCCLs to meet the high requirement of upcoming 5G or 6G era.
1 Introduction In recent years, the invention of high-frequency copper clad laminates (HFCCLs) has become a focus with the rapid development of modern information technology. As a crucial component of electronic devices with a sandwiched structure by covering the insulating layer with copper plates, HFCCLs are playing critical roles not only as a structural basis, but as also performing electrical functions for electrical devices [1–3]. The trend of miniaturization and high-density integration of electronic devices on higher frequency puts forward the requirement of higher thermal conductivity. And the dielectric permittivity is an important factor to the operational circuits, the lower the dielectric permittivity, the faster the signal transmission speed [4]. Furthermore, high mechanical properties are usually necessary to ensure HFCCLs free
* Jianfeng Zhang [email protected] 1
College of Mechanics and Materials, Hohai University, Nanjing 211100, China
Qingdao Tianhe Manufacturing Transformation and Upgrading Research Institute Co. Ltd, Qingdao 266555, China
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from falling off when used for PCBs. Therefore, the promotion of the comprehensive performance of the insulating layer, especially thermal, dielectric, and mechanical properties, has been realized of vital importance and has attracted much attention from researchers [5–7]. The insulation layer of existing thermal copper clad laminates (CCLs) is mainly composed of polymers, such as resin or po
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