Erratum to: The Effects of Composition and Microstructure on the Thermal Conductivity of Liquid-Phase-Sintered W-Cu
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DOI: 10.1007/s11661-010-0312-5 Ó The Minerals, Metals & Materials Society and ASM International 2010
Erratum to: METALLURGICAL AND MATERIALS TRANSACTIONS A, Vol. 41A, No. 6, pp. 1564–1572 DOI 10.1007/s11661-010-0210-x
FIGURE 11 is incorrect as it appears in the original article due to a typesetting error. The typesetter regrets the error. Following is the correct Figure 11:
Fig. 11—Effect of grain size on the thermal conductivity of pure, pore-free W-15Cu with a contiguity of 0.35 for different thermal boundary conductances, h. Experimental data from Table I and a previous study[33] are given for comparison.
JOHN L. JOHNSON, R&D Director, is with ATI Engineered Products, Huntsville, AL 35806. Contact e-mail: John.Johnson@ ATImetals.com SEONG JIN PARK, Assistant Professor, is with the Department of Mechanical Engineering, Pohang University of Science and Technology (POSTECH), Pohang, Gyungbuk, 790-784, S. Korea. YOUNG-SAM KWON, President, is with CetaTech, Inc., Sacheon, Gyungnam, 664-953, S. Korea. RANDALL M. GERMAN, Associate Dean, is with the College of Engineering, San Diego State University, San Diego, CA 92182-1326. The online version of the original article can be found under doi: 10.1007/s11661-010-0210-x. Article published online May 14, 2010 METALLURGICAL AND MATERIALS TRANSACTIONS A
VOLUME 41A, JULY 2010—1871
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