Experimental Investigation of Heat Transfer of Plane Heat-Removing Surfaces with Plate Finning
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Journal of Engineering Physics and Thermophysics, Vol. 93, No. 4, July, 2020
EXPERIMENTAL INVESTIGATION OF HEAT TRANSFER OF PLANE HEAT-REMOVING SURFACES WITH PLATE FINNING A. V. Baranyuk,a V. A. Rogachev,a Yu. V. Zhukova,b A. M. Terekh,a and A. I. Rudenkoa
UDC 662.997; 662.93; 628.941.8
Heat transfer of promising heat-removing surfaces with plate-slit finning intended for use in the case of air cooling of heat loaded radio- and microelectronic facilities in forced convection regime has been investigated experimentally. The influence of the depth of slitting fins and of the turning angle of their slit parts relative to the cooling flow direction on the intensity of heat transfer of the finned surface is shown. It has been established that the greatest intensifying effect is observed at the relative depth of the slitting of fins equal to 0.6, which leads to an increase in the intensity of heat release by 20–25%. The turning of the slit parts of the fins leads to heat transfer growth by 50–60% compared with traditional plate-finned surfaces. Improved dimensionless equations are suggested for calculating average heat transfer of surfaces with plate-slit finning under the conditions of forced convection in the range of the Reynolds number values from 2000 to 10,000. The results of investigation can be used in designing new systems of cooling radio- and microelectronic facilities. Keywords: radiator, heat-removing surface, finning, convective heat transfer, experiment. Introduction. Heat-removing plane finned surfaces (or radiators) are widely used for cooling radioelectronic, power electronic, and telecommunication components such as high-power semiconductor devices (diodes, bipolar transistors with isolated gates, thyristors, solid-body light sources), and integrated circuits (microcontrollers, microprocessors, high-frequency monolith integrated circuits). In the case of using straight or conical fins for developing a heat transmitting surface under the conditions of natural or forced convection, the method of designing cooling systems is determined by normative documents, for example, by the All-Union Standard 4.012.001–1978 [1]. According to this standard, first it is necessary to know the dependence of the heat transfer coefficient of a heat transmitting surface on the incoming flow velocity or the dependence of the Nusselt number on the Reynolds number Nu = f (Re). However, modern trends in the development of radioelectronic devices require scattering of large heat fluxes in small-size systems, which leads to the necessity of using heat-removing surfaces with complex finning, as well as deriving dimensionless equations for describing the dependence of the heat removal of such surfaces on the heat carrier flow characteristics. Development of effective strategies of cooling electronic devices with a high specific heat loading is needed for providing reliable operation. It has been established that the frequency of failing of the components of such devices doubles on increase of their temperature by each 10oC highe
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