Experimental investigation of heat transfer in pin-fins heat sinks for cooling applications
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TECHNICAL NOTE
Experimental investigation of heat transfer in pin-fins heat sinks for cooling applications Fadi Alnaimat 1,2
&
Mohammed Ziauddin 1
Received: 4 January 2020 / Accepted: 18 August 2020 # Springer-Verlag GmbH Germany, part of Springer Nature 2020
Abstract This study investigates the thermal performance of square pin-fin heat sinks for different operating conditions including different heat flux and different Reynolds numbers. Two heat sinks with different sizes of copper square pin-fins cross section (2-mm fins and 500-μm fins) in-line arranged are experimentally investigated to determine their thermal performance quantified in terms of thermal resistance. The investigation is carried out for a Reynolds numbers between 80 and 470, and heating rate between 21.9– 46.7 W. The results indicate that the thermal resistance is lower for micrometer sized fins for smaller Reynolds number as compared to millimeter sized. However, for the larger Reynold numbers, thermal resistance of millimeter sized fins was observed to be lower. The fluid velocity plays a very important role in heat transfer, and it has more pronounced effect on the thermal resistance compared to the fins size. Keywords Pin fins . Heat transfer fluid . Millimeter fins . Micrometer fins
1 Introduction Heat sink through forced convection with plate and pin fins is used for cooling electronic chip as well as for heat exchanging applications such as for compact cooling [1–4]. Fins provide large heat transfer surface area and promote mixing in the flow leading to higher heat transfer coefficients [5, 6]. With limitations to air-cooling of electronic devices, liquid based heat sinks are starting to take prominence. Naphon and Wiriyasart [1] used copper rectangular pin fin heat sink along with deionized water as coolant with and without thermoelectric for CPU cooling. Increasing the flow rates of coolant resulted in lowering the thermal resistance of the heat sink. Using combination of water cooling and thermoelectric, the CPU temperatures were found to be lower as compared to other cases implemented. Bhowmik et al. [7] and Shen et al. [8] examined the steady state heat transfer from a rectangular
* Fadi Alnaimat [email protected] 1
Mechanical Engineering Department, College of Engineering, United Arab Emirates University, Al Ain, UAE
2
National Water Center, United Arab Emirates University, Al Ain, UAE
channel using deionized water as a coolant. The results obtained by Bhowmik et al. [7] showed that increasing the number of chips decreased the heat transfer coefficient and the Nusselt number due to development of thermal boundary layer. Shen et al. [8] found that in the microchannel, laminar flow is affected through the surface roughness. Experimental average as well as local Nusselt numbers were lower than the theoretically calculated values. Mathew et al. [9] employed a combination of microchannel heat sink and thermoelectric cooler for thermal management of electronic chips and quantified its thermal performance in terms of thermal r
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