Fast-Setting Low-Viscous Epoxy Compositions for Impregnation and Adhesion of Electrotechnical Products
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-Setting Low-Viscous Epoxy Compositions for Impregnation and Adhesion of Electrotechnical Products V. F. Stroganova, * and I. V. Stroganovb a
Kazan State University of Architecture and Engineering, Kazan, 420043 Russia b Kazan National Research University, Kazan, 420015 Russia *e-mail: [email protected]
Received December 11, 2019; revised December 25, 2019; accepted January 10, 2020
Abstract—Improvement of electrical insulating and adhesion characteristics of epoxydian resins cured with aminoimidazoline curing agents is considered. It is determined that necessary characteristics of fabricability (low viscosity and time of curing) and adhesion and cohesion strength to various metal substrates (steel, latten brass, coper, and aluminum) require low-viscous aminoimidazoline curing agents along with epoxy active diluents. The reasonability and effectiveness of combined action of the solutions of the products of condensation represented by Mannich bases containing imidazoline rings and initial aminoimidazolines as curing agents is demonstrated. Keywords: low-viscous epoxy compounds, aminoimidazoline curing agents, adhesion and impregnation of various metals, electrotechnical products DOI: 10.1134/S1995421220040206
It is known that epoxy resins and compounds on their basis are widely employed in various fields of engineering due to the set of unique characteristics. Essential technologies of application of epoxy adhesives are being developed by means of extensive studies dedicated to the development of new curing systems [1–5]. Promising areas of application of epoxy compositions (compounds) include impregnation and adhesion of electrotechnical products, radiotechnical and electronic devices, and parts thereof [6–10]. Viscosity and time of curing are decisive process characteristics, while values of adhesion and cohesion strength to various substrates (steel, latten brass, copper, and aluminum) correspond to decisive operational characteristics. A set of electrical and dielectric characteristics, which are provided using various modifiers of epoxydian resins including aminoimidazoline curing agents, are also important parameters of these products [11; 12, pp. 112–114; 13]. The aforementioned requirements for epoxy compositions determined the aim of this work, which is to improve the above-mentioned operational characteristics of polymers for electrotechnical products through modification of aminoimidazoline curing agents and the compositions cured with them. MATERIALS AND METHODS The following materials were used in this work:
—ED-24 (epoxy number 23.5%), ED-22 (epoxy number 23.0%), and ED-20 (epoxy number 21.5%) epoxydian oligomers; —epoxy resins and compounds (active diluents), such as EBP (epoxybenzyl phenol (epoxy number is 16%); DEG-1, which is an aliphatic resin based on diethylene glycol (epoxy number is 27.54%); E-181, corresponding to the resin based on dichlorohydrins (epoxy number 30%); UP-650D cycloaliphatic resin (epoxy number up to 27.6%); and UP-616 cresyl glycidyl ester (epoxy number 23%); —plasticizer (ina
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