Fundamentals of Lead-Free Solder Interconnect Technology From Micros
This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as
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entals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
Fundamentals of Lead-Free Solder Interconnect Technology
Tae-Kyu Lee • Thomas R. Bieler Choong-Un Kim • Hongtao Ma
Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
Tae-Kyu Lee Cisco Systems, Inc. San Jose, CA, USA
Thomas R. Bieler Michigan State University East Lansing, MI, USA
Choong-Un Kim Department of Materials Science and Engineering University of Texas, Arlington Arlington, TX, USA
Hongtao Ma Lightera Corporation Sunnyvale, CA, USA
ISBN 978-1-4614-9265-8 ISBN 978-1-4614-9266-5 (eBook) DOI 10.1007/978-1-4614-9266-5 Springer New York Heidelberg Dordrecht London Library of Congress Control Number: 2014949343 © Springer Science+Business Media New York 2015 This work is subject to copyright. All rights are reserved by the Publisher, whether the whole or part of the material is concerned, specifically the rights of translation, reprinting, reuse of illustrations, recitation, broadcasting, reproduction on microfilms or in any other physical way, and transmission or information storage and retrieval, electronic adaptation, computer software, or by similar or dissimilar methodology now known or hereafter developed. Exempted from this legal reservation are brief excerpts in connection with reviews or scholarly analysis or material supplied specifically for the purpose of being entered and executed on a computer system, for exclusive use by the purchaser of the work. Duplication of this publication or parts thereof is permitted only under the provisions of the Copyright Law of the Publisher’s location, in its current version, and permission for use must always be obtained from Springer. Permissions for use may be obtained through RightsLink at the Copyright Clearance Center. Violations are liable to prosecution under the respective Copyright Law. The use of general descriptive names, registered names, trademarks, service marks, etc. in this publication does not imply, even in the absence of a specific statement, that such names are exempt from the relevant protective laws and regulations and therefore free for general use. While the advice and information in this book are believed to be true and accurate at the date of publication, neither the authors nor the editors nor the publisher can accept any legal responsibility for any errors or omissions that may be made. The publisher makes no warranty, express or implied, with respect to the material contained herein. Printed on acid-free paper Springer is part of Springer Science+Business Media (www.springer.com)
To our families
Preface
The wonders of modern technologies may seem to be achieved by the development of exotic materials such as Si and GaN single crystals, graphene, and nano-materials. However, what is not well known is the fact that those wonders exist simply because of seemingly benign-looking small piece of a metallic alloy known as solder. Without them effectively and cheaply carrying power and signals from one devi
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