High-performance printed electronics based on inorganic semiconducting nano to chip scale structures
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High‑performance printed electronics based on inorganic semiconducting nano to chip scale structures Abhishek Singh Dahiya, Dhayalan Shakthivel, Yogeenth Kumaresan, Ayoub Zumeit, Adamos Christou and Ravinder Dahiya*
Abstract The Printed Electronics (PE) is expected to revolutionise the way electronics will be manufactured in the future. Building on the achievements of the traditional printing industry, and the recent advances in flexible electronics and digital technologies, PE may even substitute the conventional silicon-based electronics if the performance of printed devices and circuits can be at par with silicon-based devices. In this regard, the inorganic semiconducting materialsbased approaches have opened new avenues as printed nano (e.g. nanowires (NWs), nanoribbons (NRs) etc.), micro (e.g. microwires (MWs)) and chip (e.g. ultra-thin chips (UTCs)) scale structures from these materials have been shown to have performances at par with silicon-based electronics. This paper reviews the developments related to inorganic semiconducting materials based high-performance large area PE, particularly using the two routes i.e. Contact Printing (CP) and Transfer Printing (TP). The detailed survey of these technologies for large area PE onto various unconventional substrates (e.g. plastic, paper etc.) is presented along with some examples of electronic devices and circuit developed with printed NWs, NRs and UTCs. Finally, we discuss the opportunities offered by PE, and the technical challenges and viable solutions for the integration of inorganic functional materials into large areas, 3D layouts for high throughput, and industrial-scale manufacturing using printing technologies. Keywords: Printed Electronics, Large area electronics, Contact printing, Transfer printing, Flexible electronics, Nanomaterials, Nanostructures, Ultra-thin chips, High-Performance 1 Introduction There is growing interest in developing large-area flexible electronics for applications across numerous sectors, including wearables, robotics, consumer electronics, and healthcare [1–6]. Flexible electronics has several advantages such as conformability to different shapes, which make it indispensable for above application areas where electronic devices are needed on unconventional substrates to either conform to curvy surfaces or to degrade naturally [7–20]. Accordingly, significant research efforts are being made to develop electronic devices and systems *Correspondence: [email protected] Bendable Electronics and Sensing Technologies (BEST) Group, University of Glasgow, Glasgow G12 8QQ, UK
with flexible form factors and novel manufacturing technologies [9, 11, 21–30]. These range from integrating off-the-shelf electronic devices on flexible printed circuit boards to printing functional inks and materials to realise active devices and circuits [21, 31]. Among these technologies, the Printed electronics (PE), defined as the printing of circuits on diverse planar and non-planer substrates such as paper, polymers and te
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