High-Throughput Screening of Thermoelectric Materials; Application of Thermal Probe Method to Composition-Spread Samples
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High-Throughput Screening of Thermoelectric Materials; Application of Thermal Probe Method to Composition-Spread Samples Atsushi Yamamoto1, Dmitry Kukuruznyak2, Parhat Ahmet2, Toyohiro Chikyow2, and Fumio S. Ohuchi3 1
Energy Electronics Institute, National Institute of Advanced Industrial Science and Technology (AIST), Tsukuba, JAPAN 2 Nanomaterials Laboratory, National Institute for Materials Science (NIMS), Tsukuba, JAPAN 3 Department of Materials Science and Engineering, University of Washington, Seattle, WA ABSTRACT In this paper, we demonstrate the use of thermal probe method that is capable of mapping Seebeck coefficient, thermal conductivity and contact resistance on a micrometer scale. We show the successful screening example on pseudo binary (Bi1-xSbx)2Te3 (0.5
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