High Volume Manufacturing and Field Stability of MEMS Products
Low volume MEMS/NEMS production is practical when an attractive concept is implemented with business, manufacturing, packaging, and test support. Moving beyond this to high volume production adds requirements on design, process control, quality, product s
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High Volume 36.1 Manufacturing Strategy ........................ 1086 36.1.1 Volume ...................................... 1086 36.1.2 Standardization .......................... 1086 36.1.3 Production Facilities .................... 1086 36.1.4 Quality....................................... 1087 36.1.5 Environmental Shield .................. 1087 36.2 Robust Manufacturing .......................... 1087 36.2.1 Design for Manufacturability ........ 1087 36.2.2 Process Flow and Its Interaction with Product Architecture............. 1088 36.2.3 Microstructure Release ................. 1095 36.2.4 Wafer Bonding............................ 1095 36.2.5 Wafer Singulation ....................... 1097 36.2.6 Particles ..................................... 1098 36.2.7 Electrostatic Discharge and Static Charges ....................... 1098 36.2.8 Package and Test ........................ 1099 36.2.9 Quality Systems ........................... 1101 36.3 Stable Field Performance....................... 1102 36.3.1 Surface Passivation...................... 1102 36.3.2 System Interface ......................... 1105 References .................................................. 1106
high surface/volume ratios, so performance and stability may depend on the control of surface characteristics after packaging. Looking into the future, the competitive advantage of IC suppliers will decrease as small companies learn to integrate MEMS/NEMS devices on CMOS foundry wafers. Packaging challenges still remain, because most MEMS/NEMS products must interact with the environment without degrading stability or reliability. Generic packaging solutions are unlikely. However, packaging subcontractors recognize that MEMS/NEMS is a growth opportunity. They will spread the overhead burden of highcapital-cost-facilities by developing flexible processes in order to package several types of moderate volume integrated MEMS/NEMS products on the same equipment.
Part E 36
Low volume MEMS/NEMS production is practical when an attractive concept is implemented with business, manufacturing, packaging, and test support. Moving beyond this to high volume production adds requirements on design, process control, quality, product stability, market size, market maturity, capital investment, and business systems. In a broad sense, this chapter uses a case study approach: It describes and compares the silicon-based MEMS accelerometers, pressure sensors, image projection systems, and gyroscopes that are in high volume production. Although they serve several markets, these businesses have common characteristics. For example, the manufacturing lines use automated semiconductor equipment and standard material sets to make consistent products in large quantities. Standard, well controlled processes are sometimes modified for a MEMS product. However, novel processes that cannot run with standard equipment and material sets are avoided when possible. This reliance on semiconductor tools, as well as the organizational practices required to manufacture clean, particle-free pro
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