Hybrid Integrated Microphotonics and It's Applications
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Hybrid Integrated Microphotonics and It's Applications Suntae Jung *and Taeil Kim Photonics Solution Laboratory, Telecommunication R&D Center, Samsung Electronics Co., Ltd. Dong Suwon P.O. Box 105, Suwon City, Korea 442-600. ABSTRACT Hybrid Integration of passive and opto-electronic devices is emerging as a key technology of optical component, because it can increase functionality and reliability of optical device module, lowers the packaging cost and enables automated manufacturing. Main applications of hybrid integrated microphotonic devices are FTTH system and metro access network. There are various technical issues in hybrid integration modules. It requires connecting an active device to a passive waveguide. The embedded functional devices such as grating, coupler, switch and filter are essential elements to improve optical performance of integrated devices. The package solution for low cost and small size is also required. We have developed SSC LD(Spot Size Converted Laser Diode) and RMF PD(Reflection Mirror Facet Photo Diode) for connecting to planar waveguide. Simple and cost-effective silica PLC platform with terraced-silica, PLC grating and coupler have been developed. Using these technologies, we have made bi-directional diplexer, triplexer and ECL(External Cavity Laser). INTRODUCTION As similar to the progressive of electronic device, photonic device has been developed from discrete device to integrated module. Recently, integration of all optical devices is emerging as a key technology of optical component, because it can increase functionality and reliability of optical device module, lowers the packaging cost and enables automated manufacturing[1,2]. Indeed, to widely adopt optics into the consumer market like as FTTH(the fiber-to-the-home), integration technique should be need to reduce the cost of module. Monolithic integration has been studied for this purpose using compound semiconductor and silicon by several research groups[3,4]. However, laser diode and photo diode are still the hurdle to overcome for telecommunication applications. As a alternative method, hybrid integration has been studied and some devices have been commercialized[1,2]. Hybrid integration of passive and optoelectronic devices requires several techniques for increasing coupling efficiency. We have developed cost-effective silica PLC platform with
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terraced-silica. For connecting to planar waveguide, SSC LD(Spot Size Converted Laser Diode) and RMF PD(Reflection Mirror Facet Photo Diode) have been also developed. To increase functionality of the hybrid integration, several passive devices such as directional coupler, PLC grating, and AWG(arrayed waveguide grating) are used for several applications which are bi-directional transceiver and ECL(External Cavity Laser). In this paper, we described the more detail results of our R&D activity for hybrid integrated microphotonics. THE COUPLING EFFICIENCY OF HYBRID INTEGRATION Hybrid integrated modules use PLC platform to connect an active device to a passive waveguide.
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