Implementation and experiment of a novel piezoelectric-spring stage for rapid high-precision micromotion
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TECHNICAL PAPER
Implementation and experiment of a novel piezoelectric-spring stage for rapid high-precision micromotion Lanyu Zhang1
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Jian Gao1
Received: 14 September 2020 / Accepted: 1 November 2020 Ó The Author(s) 2020
Abstract A precision micromotion stage is significant in the microelectronics-manufacturing field to realize high-performance tasks. The output position error and limited frequency response influence the working performance and efficiency of the micromotion stage. A novel piezoelectric-based (PZT) reciprocating micromotion stage with a special spring-PZT structure is proposed in this paper to cater to the high manufacturing demands and achieve rapid precision micromotion performance. This structure is designed to use a high-stiffness spring element as the flexure deformation structure, by utilizing the linearity of the spring, for achieving precise output/input ratio and high-frequency response. The feasibility of the micromotion stage is explored through theoretical analyses, including a dynamic response analysis, frequency response analysis, output displacement, and rapidity analysis of the specialized spring-PZT structure. For the inherent hysteresis challenge of the PZT-based structure, a feedforward subdivided proportional–integral–derivative method is adopted for system implementation. Subsequently, an optimal design of the stage is established, and the expected motion performance is verified experimentally. Finally, a series of experiments in terms of output ratio property analysis, dynamic hysteresis characterization, tracking error performance, and response rapidity are conducted for different micromotion frequencies and strokes. It is indicated that the stage can achieve nanometre-level precision and high-frequency micromotion simultaneously, which could be applied in the microelectronics manufacturing for rapid precision micromotion operations.
1 Introduction A micromotion stage is a significant motion component in microelectronic packaging manufacturing to accomplish high-frequency accurate reciprocating operations (He et al. 2019; Llewellyn-Evans et al. 2020; Gwon et al. 2014; Zhang et al. 2018a, b; Zhang et al. 2015). For example, the micromotion stage of chip wire bonding equipment should rapidly achieve nanometre-level position accuracy within the 50 ms cycle time of the packaging process (Zhang et al. 2017; Kim et al. 2006). Currently, the requirements for both high precision and efficiency in microelectronic packaging manufacturing are continuously improving (Li and Huang 2012; Khan et al. 2018). Improving the micromotion accuracy without sacrificing the high operating frequency has been a critical pursuit. & Jian Gao [email protected] 1
State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangdong University of Technology, Guangzhou 510006, China
A pioneering approach in packaging equipment is the use of piezoelectric (PZT)-based devices to play the PZT advantages of high-precision motion r
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