In Situ Analysis of Multiphase Compounds at the Liquid Al-Solid Cu Interface: Formation Sequence, Growth Kinetics and Cr
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THE bimetal interface, fabricated by combination of two different alloys with various physical and mechanical properties, has been widely investigated by many diversified manufacturing technologies, such as diffusion continuous casting,[1] aluminizing coating,[2] brazing,[3] friction stir welding[4] and compound casting.[5] Due to the low cost, excellent electrical and thermal conductivities, the liquid Al/solid Cu bimetal interface has been widely used and paid great attention to the microstructural evolution at the interface during the metallurgical bonding process.[6] Generally, the process includes the solid Cu dissolution, Al atom diffusion, diffusion reaction, and subsequent solidification. The diversified intermetallic compounds (IMCs) can be found during diffusion reaction or/and solidification. Especially, the
ZONGYE DING, QIAODAN HU, TIANXING YANG, LIAO YU, WENQUAN LU, NAIFANG ZHANG, and JIANGUO LI are with the Shanghai Key Laboratory of Materials Laser Processing and Modification, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai, 200240, P.R. China. Contact e-mail: [email protected] SHENG CAO is with the Department of Materials, The University of Manchester, Oxford Road, Manchester, M13 9PL, UK. FAN YANG is with the School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai, 200240 P.R. China. Manuscript submitted May 21, 2020.
METALLURGICAL AND MATERIALS TRANSACTIONS A
understanding of formation and growth kinetics of IMCs is a key to reveal the diffusion bonding process. Many researches focus on the various IMCs formation at the liquid Al/solid Cu interface under different processing and temperature conditions. For the diffusion reaction couples, two types of IMCs, h and c1, were found at the interface at T660 C.[1,9,10] Additionally, four types of IMCs (h, e2, c1, b)[11] or three types of IMCs (e2, c1, b)[12] were also reported at 700 C
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