Influence of Nodulizer Type on the Quality of Solder Ball
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1158-F05-04
Influence of Nodulizer Type on the Quality of Solder Ball Xiaoxiao Guo1, Yanfu Yan1, Wei Zhang2, Lifang Feng1, Miaohui Wang3 (1Henan Key Laboratory of Advanced Non-ferrous Metals, Luoyang, China 471003; 2
The First Construetion Division CO., LTD. of China Railway Tunnel Group, Chongqing, China 453000
3
Advanced Manufacture Technology Center, China Academy of Machinery Science & Technology, Beijing, China 100083)
Abstract: A solder ball is the key material of the bump fabrication in the BGA and µBGA high integrated packaging. The nodulizer type is the main factor to affect the quality of the solder ball. In the paper the solder balls are fabricated by the fine wire cutting–remelting method. The influence of different nodulizers on the real sphericity and the surface appearance of the solder balls are investigated. Results show that, the real sphericity of the 63Sn37Pb solder balls is maximum and the surface quality of the solder balls is the best compared with the engine oil, heavy oil and silicon oil when the arachis oil is used as the nodulizer. Key words: solder ball; 63Sn37Pb; nodulizer type; real sphericity; surface appearance Class code: TG156
literature indentification code: A
1 Introduction With the rapid development of the SMT（Surface Mount Technology), the size of IC (Integrated Circuit) products became smaller and smaller[1]. BGA (Ball Grid Array) package is one of the most advancing and mature high integrated packaging technology using solder balls to replace the down-lead of the packaging configuration in the IC component. Most of the CMOS chips with multi-down-leads are packaged by BGA package technology, such as the CPU package of Intel's Pentium from to IV [2, 3]. Studies on solder balls were comparatively profound in Western Developed Countries[4], especially in Europe. Rayleigh deduced that the relation between the optimal wavelength λ and the aperture of the nozzle d is λ＝4.5d. Sakai, et al[5] gained the quantitative relationship among the size of the liquid globelet drop, the nozzle frequency and the velocity of the melting solder. In the Former Soviet Union, Klopfensten produced successfully the solder balls whose diameters are less than 0.1mm by the above technology [6]. Wu Ping er al.[7，8, 9] investigated on the formation mechanism of the uniformity globelet and granulator mechanism in the vibration spraying granulation process and produced the 63Sn37Pb solder balls, but the smallest diameter of the solder balls which were produced only in the laboratory is about 0.3mm. So far, there is not yet a domestic mature equipment to produce solder ball so that the solder ball used in high integrated packaging mostly depend on the import, which severely restrict the development of the domestic high integrated packaging technology and greatly depress the international market rivalrousness of the domestic CMOS chip market. The nodulizer type, spheroidization temperature and spheroidization time are the main factors to effect the real sphericity, surface quality and microstructure of the
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