The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is the work of the European network ELFNET which was founded by the European Commission in the 6th Framework Programme. It brings together contrib
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Günter Grossmann Christian Zardini •
Editors
The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
123
Editors Günter Grossmann EMPA Überlandstrasse 129 Dübendorf CH-8600 Switzerland e-mail: [email protected]
ISBN 978-0-85729-235-3
Prof. Christian Zardini ENSEIRB Talence Cedex France
e-ISBN 978-0-85729-236-0
DOI 10.1007/978-0-85729-236-0 Springer London Dordrecht Heidelberg New York British Library Cataloguing in Publication Data A Catalogue record for this book is available from the British Library Ó Springer-Verlag London Limited 2011 Apart from any fair dealing for the purposes of research or private study, or criticism or review, as permitted under the Copyright, Designs and Patents Act 1988, this publication may only be reproduced, stored or transmitted, in any form or by any means, with the prior permission in writing of the publishers, or in the case of reprographic reproduction in accordance with the terms of licenses issued by the Copyright Licensing Agency. Enquiries concerning reproduction outside those terms should be sent to the publishers. The use of registered names, trademarks, etc., in this publication does not imply, even in the absence of a specific statement, that such names are exempt from the relevant laws and regulations and therefore free for general use. The publisher makes no representation, express or implied, with regard to the accuracy of the information contained in this book and cannot accept any legal responsibility or liability for any errors or omissions that may be made. Cover design: eStudio Calamar S.L. Printed on acid-free paper Springer is part of Springer Science+Business Media (www.springer.com)
Contents
1
Deformation and Fatigue of Solders . . . . . . . . . . . . . . . . . . . . . . Günter Grossmann
2
Factors Affecting the Bulk Embrittlement of Pb-Free Solder Joints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . K. Lambrinou
1
19
3
Thermal Fatigue Analysis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Rainer Dudek and Ellen Auerswald
65
4
Electrochemical Behavior of Solder Alloys . . . . . . . . . . . . . . . . . C. Zou and C. Hunt
81
5
Void Formation by Kirkendall Effect in Solder Joints . . . . . . . . . M. J. M. Hermans and M. H. Biglari
105
6
Tin Whiskers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Antonello Vicenzo
123
7
Electromigration in Solder Interconnects . . . . . . . . . . . . . . . . . . R. Labie
161
8
Impact of Black Pad and Intermetallic Layers on the Risk for Fractures in Solder Joints to Electroless Nickel/Immersion Gold. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P.-E. Tegehall
9
Reliability of Electronic Assemblies Under Mechanical Shock Loading . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T. T. Mattila, T. Laurila, V. Vuorinen and J. K. Kivilahti
179
197
v
vi
10
11
Contents
Impact of Humidity and Contamination on Surface Insulation Res
Data Loading...
