Influences of brush plating solutions composition and technological parameters on the quality of rolled copper foil surf
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efeng Liua) Laboratory of Advanced Processing Technology of Materials (LAPTM), School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, People’s Republic of China; and Beijing Laboratory of Metallic Materials and Processing for Modern Transportation, University of Science and Technology Beijing, Beijing 100083, People’s Republic of China (Received 14 October 2015; accepted 20 November 2015)
The technologies of brush plating and dealloying were used to treat the surface of rolled copper foil. Zn–Ni and Sn–Zn alloy coatings were prepared. The laws of plating solutions composition and technological parameters on coatings quality were investigated. The results show that with the decreasing of main elements mass ratio or increasing of brush time, thickness and corrosion resistance of Zn–Ni alloy coating increase. With the increasing of brush plating voltage or time, surface roughness of Sn–Zn alloy coating decreases. Turning up brush plating voltage could raise deposition rate of sub-tin and zinc ions and refine surface grains of coating. The angle of dealloying has the significant effect on the roughness of dealloyed Sn–Zn alloy coating. As the dealloying angle increases, surface roughness of dealloyed Sn–Zn alloy coating increases. The contribution of dealloying time to surface roughness of treated coating is obviously larger than that of corrosion solution concentration.
I. INTRODUCTION
Contributing Editor: Jürgen Eckert a) Address all correspondence to this author. e-mail: [email protected] DOI: 10.1557/jmr.2015.369
the surface roughness of copper foil to improve the bond strength between copper and the adhesive.2 Sun and O’Keefe3 reported that large specific surface area of copper foil and increased bonding strength between copper foil and resin substrate can be obtained through strict control of process parameters and electroplating solution composition. For a certain scope to improve current density and extend electroplating time, the surface roughness of copper foil coating would be increased. The study showed that morphology and structural stability of sediment layer were conductive to get a higher bonding strength between micro dendritic copper deposits and resin substrate. The morphology of micro dendritic copper deposits can be improved by using electrolytes containing additives such as thiourea, chloride ion, and their combinations. However, using a low current density, additive cannot help obtain micro dendritic copper deposits and improve roughness of copper deposits coatings. Compared with peel strength of an untreated copper surface, the values for micro dendritic copper deposits on copper foil could be improved almost 20 times. Lee et al.4 found that rolled copper foil underwent nodule treatment via electroplating in a solution containing dissolved CuSO4 and NiSO4, and the electroplating product composition and morphology varied with increasing current density and plating time. The copper oxide was coated ahead at a low current density and
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