Low Temperature Solution-Based Fabrications of Metal Oxide Semiconductor Films by Mechanical Sintering
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1113-F09-15
Low Temperature Solution-Based Fabrications of Metal Oxide Semiconductor Films by Mechanical Sintering. Manabu Yoshida, Kouji Suemori, Sei Uemura, Satoshi Hoshino, Noriyuki Takada, Takehito Kodzasa, and Toshihide Kamata Photonics Research Institute, National Institute of Advanced Industrial Science and Technology (AIST), JAPAN, Central 5, 1-1-1 Higashi, Tsukuba, Ibaraki 305-8565 JAPAN ABSTRACT Various flexible electronic devices have been intensively studied and developed in this decade. Most of consumers expect to obtain these flexible electronic devices in the next decade. The spread of flexible electronic devices depends on the process costs and material costs. Today prices of materials and energy sources are continuously increasing. Therefore, using of expensive materials and wasteful processes for fabricating electronic devices should be reconsidered. Printing techniques, a representative solution process, are inexpensive and very effective for mass production of electronic devices. We have developed a low-temperature process for fabricating flexible printed patterns of metals and semiconductors by using relatively inexpensive commercial pastes. A characteristic of our process is to utilize mechanical energies for sintering particles contained in pastes. In our process, the precise three-dimensional pressure control brings about the improvement of electrical properties in the printed patterns, the preservation of pattern accuracy and the mechanical durability of the printed patterns. In our experiment, we have already fabricated very low resistivity metal patterns (about 6×10-6Ω⋅cm) at ca.120°C without using any kinds of nano-particle paste, and also fabricated metal oxide semiconductor patterns. INTRODUCTION 1.Recent social needs In recent years, the flexible wiring is the key technology to downsize information appliances and mobile devices. In the wiring technology, the most important issue is process-cost, throughput, quality of products (electrical properties and so on), for fabricating the devices on flexible plastic substrates. Especially, in order to fabricate flexible antennas for wireless communications (e.g. RFID), many issues, for improving electrical properties and the efficiency of their production processes, have still remained. Further, in the global electronics market, lead-free process has become indispensable. With a shift to the lead-free process, we have to look for proper materials and to re-design circuits for adjusting to these materials. 2.Adaptation and the problem of the print process The most promising and remarkable method to solve the issues mentioned previously is the print process. Employing the print process will save wasteful production energies and will produce a large amount of electrical circuits effectively. Conventional photolithography process and chemical etching process are a subtractive process while the print process is an additive process. Therefore, only minimum materials are required in order to produce electrical circuits by using the print process, in
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