Material Systems Used by Micro Dispensing and Ink Jetting Technologies
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"**University
of Illinois at Chicago
ABSTRACT In today's electronic industry, manufacturers are continuously improving capital utilization, developing flexible manufacturing processes, reduce changeover time and improving yield and throughput. Interest in rapid prototyping and 3-D fabrication capabilities are rapidly increasing, and a number of candidate direct writing technologies are in development to meet these demands. This work studies material systems used by data driven materials deposition (DDMD) technologies for potential low temperature reel-to-reel high volume manufacturing on low cost substrates. Characterization results of fabricated discrete and RF devices using commercially available micro dispensing and ink jet systems will be discussed. Material rheological properties, deposition process characterization, deposition repeatability, fabricated device reliability and electrical performance will be presented. The test vehicles contain resistors and capacitors, transmission lines, open and short series stub filters, and half-wavelength resonators. The material/substrate compatibility will be demonstrated through environmental conditioning of the test vehicles. In addition, a cost estimate for using micro dispensing technologies was conducted to compare current manufacturing technologies to DDMD. INTRODUCTION Product miniaturization and functionality enhancement have demanded the development of advanced manufacturing technologies and processes. DDMD technologies contain many attributes: low cost, flexible patterning, fast change over, and reel-to-reel processes. Micro dispensing and ink jetting may replace traditional manufacturing methods to meet market demands [I]. Micro dispensing is the most familiar DDMD technology to high volume manufacturing. It has been used for chip encapsulation, molding, conductive adhesive deposition and solder joint repair. The micro-dispensing tools from the different suppliers are based on different pump technologies: positive displacement pumps, auger screw driven pumps, and various valve pump systems. The deposition methods also include contact and non-contact processes. The micro dispensing vendors for electronic applications are Asymtek, Camalot, Nordson and MRSI, Ohmcraft, Vacuum Metallurgical Corp. Lt. (VMC). Micropen Tm from Ohmcraft uses contact dispensing while the others are non-contact systems. The aforementioned suppliers sell production ready systems for integration into electronic product manufacturing lines. These systems are capable of dispensing materials having a broad range of rheological properties.
41 Mat. Res. Soc. Symp. Proc. Vol. 624 © 2000 Materials Research Society
Ink jet technology is a material deposition method used in the printing industry. The first attempt to use this technology in electronic manufacturing was the solder jet system -jetting molten Sn/Pb solder on IC chips to form IC interconnects [2]. There are two types of jetting systems: drop-on-demand and continuous jetting. The driving force for ejecting droplets can be electro-me
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