Matrix Assisted Pulsed Laser Evaporation Direct Write (MAPLE DW): A New Method to Rapidly Prototype Active and Passive E
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J.M. Fitz-Gerald, D.B. Chrisey, A. Piqu, R.C.Y. Auyeung, R. Mohdi, H.D. Young, H.D. Wu, S. Lakeou, and, R. Chung Naval Research Laboratory, Washington, D.C.
Abstract We demonstrate a novel laser-based approach to perform rapid prototyping of active and passive circuit elements called MAPLE DW. This technique is similar in its implementation to laser induced forward transfer (LIFT), but different in terms of the fundamental transfer mechanism and materials used. In MAPLE DW, a focused pulsed laser beam interacts with a composite material on a laser transparent support transferring the composite material to the acceptor substrate. This process enables the formation of adherent and uniform coatings at room temperature and atmospheric pressure with minimal post-deposition modification required, i.e., < 400'C thermal processing. The firing of the laser and the work piece (substrate) motion is computer automated and synchronized using software designs from an electromagnetic modeling program validating that this technique is fully CAD/CAM compatible. The final properties of the deposited materials depend on the deposition conditions and the materials used, but when optimized, the properties are competitive with other thick film techniques such as screenprinting. Specific electrical results for conductors are < 5X the resistivity of bulk Ag, for BaTiO 3/TiO 2 composite capacitors the k can be tuned between 4 and 100 and losses are < 1-4%, and for polymer thick film resistors the compositions cover 4 orders of magnitude in sheet resistivity. The surface profiles and fracture cross-section micrographs of the materials and devices deposited show that they are very uniform, densely packed and have minimum resolutions of -10 gim. A discussion of how these results were obtained, the materials used, and methods to improve them will be given.
99 Mat. Res. Soc. Symp. Proc. Vol. 625 ©2000 Materials Research Society
Introduction There is a strong need in industry for new design and Just In Time Manufacturing (JITM) methods, materials, and tools to direct write for rapid prototyping passive circuit elements on various substrates, especially in the mesoscopic regime, i.e., electronic devices that straddle the size range between conventional microelectronics (sub-micronrange) and traditional surface mount components (10 mm-range). The need is based on the desire: to rapidly fabricate prototype circuits without iterations in photolithographic mask design, in part, in an effort to iterate the performance on circuits too difficult to accurately model, to reduce the size of PCB s and other structures (-30-50% or more) by conformally incorporating passive circuit elements into the structure, and to fabricate parts of electronic circuits by methods which occupy a smaller footprint, which are CAD/CAM compatible, and which can be operated by unskilled personnel or totally controlled from the designers computer to the working prototype. Mesoscopic direct write approaches are not intended to compete with current photolithographic circuit des
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