Mechanical Behavior of Thin Films
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stance,1 one of the papers presented was entitled simply "Mechanical Properties of Thin Films." Within the last decade, however, and due largely to developments within the microelectronic and magnetic disk industries, awareness of the need to predict, control, and understand the mechanical behavior of thin film media has grown rapidly. Many of the most important failure mechanisms operative in integrated circuits, for example, such as stress and electromigration voiding, are mechanical in nature. One of the major difficulties encountered in studying the mechanical behavior of thin films is that, by virtue of their size and configuration, they are not amenable to testing by conventional means. Although some extrapolation of normal testing procedures have been made, e.g., microtensile testing, new methods have also had to be developed. The first three articles in this issue address the testing and evaluation of thin film mechanical properties. The fourth article examines, primarily from a theoretical viewpoint, dislocation flow as a means for strain relaxation in epitaxial
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films. Such films are increasingly of interest for their unique electronic, optical, and mechanical properties. The final article illustrates that thin film mechanical behavior can have important technological consequences. In it, the authors present their views concerning the nature of stress and electromigration-induced failure, subjects about which there is still considerable controversy. Needless to say, these five articles cannot fully cover this rapidly expanding field. Interested readers are directed to the growing number of literature sources, and perhaps could be well served by starting with some of the references listed below"'7 that deal directly with thin film mechanical behavior.
References 1. Thin Films: Papers Presented at a Seminar of the American Society of Metals, edited by H.G.F. Wilsdorf (American Society of Metals, 1964). 2. Thin Films: Stresses and Mechanical Properties, edited by J.C. Bravman, W.D. Nix, D.M. Barnett, and D.A. Smith (Mater. Res. Soc. Symp. Proc. 130, Pittsburgh, PA, 1989). 3. "Mechanical Properties of Thin Films," WD. Nix, Metall. Trans. 20A (1989) p. 2217. 4. Thin Films: Stresses and Mechanical Properties II, edited by M. Doerner, W.C. Oliver, G.M. Pharr, and ER. Brotzen, (Mater. Res. Soc. Symp. Proc. 188, Pittsburgh, FA, 1992). 5. Materials Reliability Issues in Microelectronics, edited by J.R. Lloyd, P.S. Ho, C.T. Sah, and F.G. Yost (Mater. Res. Soc. Symp. Proc. 225, Pittsburgh, PA, 1991). 6. Mechanical Behavior of Materials and Structures in Microelectronics, edited by E. Suhir, R.C. Cammarata,D.D.L. Chung, and M. Jono (Mater. Res. Soc. Symp. Proc. 226, Pittsburgh, PA, 1991). 7. Thin Films: Stresses and Mechanical Properties III, edited by W.D. Nix, J.C. Bravman, E. Arzt, and L.B. Freund (Mater. Res. Soc. Symp. Proc. 239, Pittsburgh, PA, 1992). •
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