Microstructure and Connection Mechanism of the Bonding Interface Between Lithium Ion Polymer Electrolyte and Aluminum Un
- PDF / 1,551,378 Bytes
- 7 Pages / 595.276 x 790.866 pts Page_size
- 70 Downloads / 178 Views
Microstructure and Connection Mechanism of the Bonding Interface Between Lithium Ion Polymer Electrolyte and Aluminum Under Strong Electrostatic Field Xu Yin1 · Cui‑Rong Liu1 · Yuan‑Yuan Meng1 · Li‑Fo Zhang1 Received: 31 March 2020 / Accepted: 23 June 2020 © Springer Science+Business Media, LLC, part of Springer Nature 2020
Abstract The effects of different lithium salt contents on the crystallinity and conductivity of solid polymer electrolytes PEO-LiClO4 were analyzed by DSC thermal analysis method and AC impedance method. Furthermore, the variation of bonding current and time during the bonding process between metal aluminum and PEO-LiClO4 with different LiClO4 content was studied under different bonding voltages. The results show that with the addition of lithium salt and increasing its content, it can effectively hinder the crystallization of PEO and improve its room temperature conductivity. The more the lithium salt content, the higher the bonding voltage, the larger the peak current generated during the bonding process, the thicker the intermediate transition layer, and the higher the bonding strength. Keywords Lithium salt content · Solid polymer electrolytes · Conductivity · Anodic bonding
1 Introduction MEMS sensors are microelectro mechanical systems. After more than 40 years of development, they have become one of the world’s major scientific and technological fields [1]. Packaging is one of the important links in manufacturing MEMS devices. The quality of packaging will directly affect the service life of MEMS devices [2]. Solid Polymer Electrolytes (SPE) is a functional material that has been vigorously developed in recent years [3]. Due to the abundant source of polymer raw material polyethylene oxide (PEO), complexing lithium salts is easy. And the molecular structure of PEO determines its performance, easy processing and easy modification. Therefore, as a packaging material for MEMS devices, it can further promote the development of the MEMS industry [4]. Anodic bonding technology is essentially a solid electrochemical reaction process, and this technology mainly depends on the ionic conductivity of the solid electrolyte [5]. Generally, solid electrolyte materials are composed of two sets of lattice, one is skeleton ion * Xu Yin [email protected] 1
Taiyuan University of Science and Technology, Taiyuan 030024, Shanxi, China
lattice, the other is migration ion sublattice [6]. By increasing the carrier concentration, when the number of migrating ions in the solid electrolyte far exceeds the position that the framework crystal itself can provide, a high-conductivity solid polymer electrolyte material can be obtained, thereby achieving fast ion conduction [7]. The anodic bonding technology is aimed at the special structure of this fast ion conductor to achieve the connection between the fast ion conductor and metal or semiconductor packaging materials [8]. Among the materials that use anodic bonding technology to achieve packaging, the more mature materials currently used are mainly from Pyrex
Data Loading...
