Multi-beam SEM Technology for High Throughput Imaging

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Multi-beam SEM Technology for High Throughput Imaging Kyle Crosby, Anna Lena Eberle and Dirk Zeidler MRS Advances / FirstView Article / June 2016, pp 1 - 6 DOI: 10.1557/adv.2016.363, Published online: 18 May 2016

Link to this article: http://journals.cambridge.org/abstract_S2059852116003637 How to cite this article: Kyle Crosby, Anna Lena Eberle and Dirk Zeidler Multi-beam SEM Technology for High Throughput Imaging. MRS Advances, Available on CJO 2016 doi:10.1557/adv.2016.363 Request Permissions : Click here

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MRS Advances © 2016 Materials Research Society DOI: 10.1557/adv.2016.363

Multi-beam SEM Technology for High Throughput Imaging Kyle Crosby1, Anna Lena Eberle² and Dirk Zeidler2 1Carl Zeiss Microscopy, LLC, 1 Zeiss Drive, Thornwood, NY 10594, U.S.A. 2Carl Zeiss Microscopy, GmbH, Carl-Zeiss-Straße 22, 73447 Oberkochen, Germany ABSTRACT Recent developments in a number of fields call for high-throughput, high-resolution imaging of large areas. Examples are reconstruction of macroscopic volumes of mouse brain tissue, or wafer defect inspection. To address these needs, we have developed a multi-beam, single column SEM which utilizes an array of 61 or 91 electron beams and detectors in parallel. The total possible detection speed of the multiple beam SEM is the single detection speed times the number of beams. In the same time a single beam SEM creates an image of several million pixels size, the multi-beam SEM produces between several hundred million and one billion pixels. Herein we demonstrate the capabilities of generating massive data sets using the multi-beam SEM on a variety of samples including brain tissue serial sections and semiconductor test wafers. INTRODUCTION Large area imaging with high spatial resolution in rapid fashion allows one to probe structures that span many length scales. Nanoscale properties can have a direct impact on organ level function and device level performance in biological science and materials science applications respectively. Sampling of large areas with nanometer pixel resolution is increasingly relevant for modern research, therefore the multi-beam SEM can be employed to determine how materials can cease to function through reverse engineering and failure analysis methods. For example, failure of bulk components can arise from the summation of defects that exist within a small region of a material. Proliferation of these defects to the larger scale can dramatically affect the properties and performance of the final device. Being able to track this proliferation from the outset is of great importance in predicting why materials become damaged and ultimately fail. However, this requires being able to find features only a few nanometers in size over an area measuring many square millimeters or even square centimeters, which is literally equivalent to finding a needl